Board-to-board connector in medical medical technology
The Right Contacts in the Medical medical technology Industry
In medical medical technology, connected MedTech devices with an increasing number of smart sensors will dominate the landscape. The strictest regulations and the highest level of failure protection set the standards that the products and components used must meet. Miniaturization, data rate, and electromagnetic radiation are the specific requirements that board-to-board connector must meet. For hardware developers, these are criteria that significantly shape device design.
Today, patients still have to adapt to the structures of the healthcare system. By tomorrow—and Deloitte’s projections apply to 2025—healthcare will be oriented exactly the other way around, focusing on patients, their location, and their schedule. The shift toward this “4P medicine” (predictive, preventative, personalized, participatory) is being driven by many digital innovations.
This paradigm shift will be evident among medical device manufacturers. The number of smart sensors is increasing as products become connected within the Internet of Medical Things (IoMT). Patient care is becoming more convenient, for example through wireless connections to electronic health records and the real-time transmission and monitoring of vital signs. Data analytics, cognitive methods, and robotics are opening up further areas of potential in the healthcare sector.
This paradigm shift will be evident among medical device manufacturers. The number of smart sensors is increasing as products become connected within the Internet of Medical Things (IoMT). Patient care is becoming more convenient, for example through wireless connections to electronic health records and the real-time transmission and monitoring of vital signs. Data analytics, cognitive methods, and robotics are opening up further areas of potential in the healthcare sector.
High Speed and EMC: Key Focus Areas for Medical Technology Devices
Medical imaging systems such as CT scanners, MRI machines, and digital X-ray machines process up to 20 Gbit/s of image and patient data in real time. The same applies to telemedicine and remote monitoring applications. Similarly, in surgical robotics, real-time transmission of images and control commands between the surgeon’s console and the robotic system is required. High-resolution endoscopy, as well as implantable devices and patient monitoring systems, are other fields that rely on data transmission but also prioritize EMC design aspects for immunity and patient safety.
Other trends, such as the rise of multi-source sensor technology and increasingly interconnected systems, demand fast, reliable, and secure data transmission across various interfaces—a fact that applies particularly to medtech devices. Signal signal integrity plays a crucial role in these applications, where highly precise and reliable data is paramount. Constant currents and accurate data are essential for ensuring the functional safety, reliability, and efficiency of the devices. High bit rates—sometimes transmitted over long distances—can be so severely compromised by interference such as noise, (back)feedback losses, distortion, and crosstalk that errors occur and devices fail.
Other trends, such as the rise of multi-source sensor technology and increasingly interconnected systems, demand fast, reliable, and secure data transmission across various interfaces—a fact that applies particularly to medtech devices. Signal signal integrity plays a crucial role in these applications, where highly precise and reliable data is paramount. Constant currents and accurate data are essential for ensuring the functional safety, reliability, and efficiency of the devices. High bit rates—sometimes transmitted over long distances—can be so severely compromised by interference such as noise, (back)feedback losses, distortion, and crosstalk that errors occur and devices fail.
Compliance with relevant industry standards
Within the framework of regulatory requirements such as the Medical Device Regulation (MDR) in the European Union or the Food and Drug Administration (FDA) regulations in the U.S., it is essential to ensure the approval and safe use of the devices. Another trend among all hardware designers is the need to utilize the ever-shrinking installation space in medical devices even more efficiently, while the stresses on the devices—including shock, vibration, and oscillations, as well as thermal and chemical environmental influences—continue to demand robustness from all devices.
Furthermore, there are three focused, application-specific industry standards for medtech devices that must be taken into account in all designs. First, ISO 80369-1, which addresses the design methodology for reducing the risk of incorrect connection of medical devices or accessories. Second, IEC 60601, which describes the general requirements for basic safety and essential performance characteristics, including electromagnetic interference (EMI) and electromagnetic compatibility (EMC). And third, ISO 13485, which pertains to quality management systems responsible for the traceability of components and processes used in the production process.
Furthermore, there are three focused, application-specific industry standards for medtech devices that must be taken into account in all designs. First, ISO 80369-1, which addresses the design methodology for reducing the risk of incorrect connection of medical devices or accessories. Second, IEC 60601, which describes the general requirements for basic safety and essential performance characteristics, including electromagnetic interference (EMI) and electromagnetic compatibility (EMC). And third, ISO 13485, which pertains to quality management systems responsible for the traceability of components and processes used in the production process.
Board-to-board connector as signal transmitters
As the complexity and integration density in medical devices continue to rise, and existing and new functionalities must be integrated into the tightest of spaces, the demands placed on board-to-board connector—which serve as a bridge between circuit boards—are immensely high. A wide variety of operating locations and environments subject the devices to vibrations and shocks. The connectors must ensure long-term contact reliability even during micro-movements. Ruggedness, data transmission, and EMC shielding are the three cornerstones of mechanical device design for hardware developers.
The latest generation of connector must minimize interference in signal transmission, and the contact design of the connectors must be perfectly tailored to this purpose. Therefore, the goal is always to mitigate risks in data transmission, which primarily include impedance fluctuations caused by changes in material and geometry, as well as attenuation due to insertion loss and return loss, and crosstalk.
The latest generation of connector must minimize interference in signal transmission, and the contact design of the connectors must be perfectly tailored to this purpose. Therefore, the goal is always to mitigate risks in data transmission, which primarily include impedance fluctuations caused by changes in material and geometry, as well as attenuation due to insertion loss and return loss, and crosstalk.
Signal protection as a foundation
With regard to electromagnetic interference, high-speed signals require special signal protection. A connector (connector) can act as both a source of interference and a sink. In this case, signal protection using a shielding plate (shield plate) is recommended to protect the sensitive signals from external influences. The image below illustrates that even a small electrical pulse can distort the useful signal.
The receiver can no longer unambiguously interpret the digital states of the HDMI signal after even a short burst pulse of 0.5 kV, whereas the signal transmission via the shielded connector remains stable even at 4.4 kV.
The coupling inductance (mutual inductance, LK) characterizes the connector based on the electrical conditions in both modes—source and sink. This applies to both immunity (immunity) and electromagnetic emission (electromagnetic emission). If the induced voltage (Uind), the generator voltage (UGen), and the generator constant (kGen) are known, the specific maximum permissible coupling inductance (LK) can be determined using this equation:
LK = Uind / (UGen * kGen) (Eq. 1)
The mutual inductance also helps the user select the appropriate connector based on its electromagnetic compatibility and avoid costly and time-consuming trial-and-error testing in the EMC-Labor. Here is an example: For an HDMI signal, a case-specific maximum “mutual inductance” of 47 pH was determined at a voltage of 4.4 kV. If the value exceeds this, the signal will no longer be transmitted without interference.
The coupling inductance (mutual inductance, LK) characterizes the connector based on the electrical conditions in both modes—source and sink. This applies to both immunity (immunity) and electromagnetic emission (electromagnetic emission). If the induced voltage (Uind), the generator voltage (UGen), and the generator constant (kGen) are known, the specific maximum permissible coupling inductance (LK) can be determined using this equation:
LK = Uind / (UGen * kGen) (Eq. 1)
The mutual inductance also helps the user select the appropriate connector based on its electromagnetic compatibility and avoid costly and time-consuming trial-and-error testing in the EMC-Labor. Here is an example: For an HDMI signal, a case-specific maximum “mutual inductance” of 47 pH was determined at a voltage of 4.4 kV. If the value exceeds this, the signal will no longer be transmitted without interference.
Designed specifically for demanding industrial applications
The Zero8 product family from ept has been designed to meet these high standards in medical technology (medical technology) and, thanks to its high scalability, offers ideal adaptation to individual requirements—types, stacking height (stack height), and the number of positions can be selected individually. Sockets and connector are currently available in mid-profile and low-profile and will also be available in the future as high-profile and angled versions. Thanks to the various heights, Zero8 connectors can accommodate board-to-board distances ranging from 6.00 mm to 21.00 mm, with the number of positions varying between 12 and 80. For shielding, shielding can be applied to either side of the mated connector pair; naturally, all Zero8 connectors are interconnectable and can be freely combined.
The ScaleX double-sided connection technology can withstand the harsh conditions of industrial applications and ensures reliable contact under mechanical stress such as shock and vibration. It also compensates for device-side tolerances in all directions when the connectors are mated. EMC shielding protects signals in industrial environments from external influences, and the material properties guarantee a data rate of up to 16 Gbit/s.
More information about Zero8 »
The ScaleX double-sided connection technology can withstand the harsh conditions of industrial applications and ensures reliable contact under mechanical stress such as shock and vibration. It also compensates for device-side tolerances in all directions when the connectors are mated. EMC shielding protects signals in industrial environments from external influences, and the material properties guarantee a data rate of up to 16 Gbit/s.
More information about Zero8 »
The importance of selecting the right connector for a high-speed application should not be underestimated. As described here, there are many concurrent requirements, particularly in the medical technology sector. The mechanical or electrical properties that board-to-board connector must meet, or the design of the connector’s peripheral connections—these are all intricate details that can be decisive in the selection process, pin by pin.
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Submit an inquiry via the form
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sales@ept.de
Then please contact us!
Submit an inquiry via the form
+49 (0) 8861 2501 0
sales@ept.de