Board-to-board connectors in medical technology
The right contacts in the medical technology industry
In medical technology, connected medtech devices equipped with an increasing number of smart sensors will dominate the landscape. Strictest regulations and the highest level of failure protection dictate the path that the products and components used must follow. Miniaturization, data transfer rates, and electromagnetic radiation are the specific requirements that board-to-board connectors must meet. For hardware developers, these are criteria that significantly shape device design.
Today, patients still have to adapt to the structures of the healthcare system. By tomorrow—and Deloitte’s projections apply to 2025—healthcare will be oriented exactly the other way around, focusing on patients, their location, and their schedule. The shift toward this “4P medicine” (predictive, preventative, personalized, participatory) is being driven by many digital innovations.
This paradigm shift will be evident among medical device manufacturers. The number of smart sensors is increasing as products become connected within the Internet of Medical Things (IoMT). Patient care is becoming more convenient, for example through wireless connections to electronic health records and the real-time transmission and monitoring of vital signs. Data analytics, cognitive methods, and robotics are opening up further areas of potential in the healthcare sector.
This paradigm shift will be evident among medical device manufacturers. The number of smart sensors is increasing as products become connected within the Internet of Medical Things (IoMT). Patient care is becoming more convenient, for example through wireless connections to electronic health records and the real-time transmission and monitoring of vital signs. Data analytics, cognitive methods, and robotics are opening up further areas of potential in the healthcare sector.
High Speed and EMC in Medical Devices
Medical imaging systems such as CT scanners, MRI machines, and digital X-ray systems process up to 20 Gbit/s of image and patient data in real time. The same applies to telemedicine and remote monitoring applications. Similarly, surgical robotics requires the real-time transmission of images and control commands between the surgeon’s console and the robotic system. High-resolution endoscopy, as well as implantable devices and patient monitoring systems, are other fields that rely on data transmission but also place a high priority on EMC design aspects for immunity to interference and patient safety.
Other trends, such as the rise of multi-source sensor technology and increasingly interconnected systems, demand fast, reliable, and secure data transmission across various interfaces—a fact that applies particularly to medtech devices. Signal integrity plays a crucial role in these applications, where highly precise and reliable data is paramount. Constant currents and accurate data are essential to ensure the functional safety, reliability, and efficiency of the devices. High bit rates, sometimes over long distances, can be so severely affected by interference such as noise, (back)coupling losses, distortion, and crosstalk that errors occur and devices fail.
Other trends, such as the rise of multi-source sensor technology and increasingly interconnected systems, demand fast, reliable, and secure data transmission across various interfaces—a fact that applies particularly to medtech devices. Signal integrity plays a crucial role in these applications, where highly precise and reliable data is paramount. Constant currents and accurate data are essential to ensure the functional safety, reliability, and efficiency of the devices. High bit rates, sometimes over long distances, can be so severely affected by interference such as noise, (back)coupling losses, distortion, and crosstalk that errors occur and devices fail.
Compliance with relevant industry standards
Subject to regulatory requirements such as the Medical Device Regulation (MDR) in the European Union or the Food and Drug Administration (FDA) regulations in the United States, it is essential to ensure the approval and safe use of these devices. Another trend among hardware designers is the need to utilize the increasingly limited installation space in medical devices even more efficiently, while the stresses on the devices—including shock, vibration, and oscillations, as well as thermal and chemical environmental influences—continue to demand robustness in all devices.
Furthermore, there are three focused, application-specific industry standards for MedTech devices that must be taken into account in all designs. First, ISO 80369-1, which addresses the design methodology for reducing the risk of incorrect connection of medical devices or accessories. Second, IEC 60601, which describes the general requirements for basic safety and essential performance characteristics, including electromagnetic interference (EMI) and electromagnetic compatibility (EMC). And third, ISO 13485, which pertains to quality management systems responsible for the traceability of components and processes used in the production process.
Furthermore, there are three focused, application-specific industry standards for MedTech devices that must be taken into account in all designs. First, ISO 80369-1, which addresses the design methodology for reducing the risk of incorrect connection of medical devices or accessories. Second, IEC 60601, which describes the general requirements for basic safety and essential performance characteristics, including electromagnetic interference (EMI) and electromagnetic compatibility (EMC). And third, ISO 13485, which pertains to quality management systems responsible for the traceability of components and processes used in the production process.
Board-to-board connectors as signal transmitters
As the complexity and integration density of medical devices continue to rise, and as existing and new functionalities must be integrated into extremely confined spaces, the demands placed on board-to-board connectors—which serve as a bridge between circuit boards—are immense. A wide variety of operating environments and applications subject the devices to vibrations and shocks. Connectors must ensure long-term contact reliability even during micro-movements. Robustness, data transmission, and EMC shielding are the three cornerstones of mechanical device design for hardware developers.
The latest generation of connectors must minimize interference in signal transmission, and the contact design of the connectors must be perfectly tailored to this. Therefore, the goal is always to mitigate risks in data transmission, which primarily include impedance fluctuations caused by changes in material and geometry, as well as attenuation due to insertion loss and return loss, and crosstalk.
The latest generation of connectors must minimize interference in signal transmission, and the contact design of the connectors must be perfectly tailored to this. Therefore, the goal is always to mitigate risks in data transmission, which primarily include impedance fluctuations caused by changes in material and geometry, as well as attenuation due to insertion loss and return loss, and crosstalk.
Signal protection as a foundation
High-speed signals require special signal protection against electromagnetic interference. A connector can act as both a source of interference and a sink. In this case, signal protection using a shielding plate is recommended to protect sensitive signals from external interference. The image below illustrates how even a small electrical pulse can distort the useful signal.
The receiver can no longer reliably interpret the digital states of the HDMI signal after just a short burst of 0.5 kV, whereas the signal transmission through the shielded connector remains stable even at 4.4 kV.
The coupling inductance LK characterizes the connector based on the electrical conditions in both modes—source and sink. This applies to both immunity and emissions. If the induced voltage (Uind), the generator voltage (UGen), and the generator constant (kGen) are known, the specific maximum permissible coupling inductance (LK) can be determined using this equation:
LK = Uind / (UGen * kGen) (Eq. 1)
The coupling inductance also helps the user define the appropriate connector in terms of its electromagnetic compatibility and avoid costly and time-consuming trial-and-error testing in the EMC laboratory. For example, for an HDMI signal, a case-specific maximum coupling inductance of 47 pH was determined at a voltage of 4.4 kV. If the value exceeds this, the signal will no longer be transmitted without interference.
The coupling inductance LK characterizes the connector based on the electrical conditions in both modes—source and sink. This applies to both immunity and emissions. If the induced voltage (Uind), the generator voltage (UGen), and the generator constant (kGen) are known, the specific maximum permissible coupling inductance (LK) can be determined using this equation:
LK = Uind / (UGen * kGen) (Eq. 1)
The coupling inductance also helps the user define the appropriate connector in terms of its electromagnetic compatibility and avoid costly and time-consuming trial-and-error testing in the EMC laboratory. For example, for an HDMI signal, a case-specific maximum coupling inductance of 47 pH was determined at a voltage of 4.4 kV. If the value exceeds this, the signal will no longer be transmitted without interference.
Designed specifically for demanding industrial applications
The zero8 product family from ept has been designed to meet these high standards in medical technology and, thanks to its high scalability, offers ideal adaptation to individual requirements—housing types, stacking height, and pin counts can be selected individually. Sockets and connectors are currently available in mid-profile and low-profile versions and will also be available in the future as high-profile and angled versions. Thanks to the various heights, Zero8 connectors can accommodate PCB spacing from 6.00 mm to 21.00 mm, with the number of pins ranging from 12 to 80. For shielding purposes, both sides of the connector pair can be equipped with shielding; naturally, all Zero8 connectors are interconnectable and freely combinable.
The ScaleX double-sided connection technology withstands the harsh conditions of industrial applications and ensures reliable contact under mechanical stress such as shock and vibration. Additionally, it compensates for device-side tolerances in all directions when mated. EMC shielding protects signals in industrial environments from external influences, and the material properties guarantee a data transfer rate of up to 16 Gbit/s.
More information about Zero8 »
The ScaleX double-sided connection technology withstands the harsh conditions of industrial applications and ensures reliable contact under mechanical stress such as shock and vibration. Additionally, it compensates for device-side tolerances in all directions when mated. EMC shielding protects signals in industrial environments from external influences, and the material properties guarantee a data transfer rate of up to 16 Gbit/s.
More information about Zero8 »
The importance of selecting the right connector for a high-speed application should not be underestimated. As described here, there are many concurrent requirements, particularly in the medical technology sector. Which mechanical or electrical properties the board-to-board connectors must meet, or how the connector’s terminal configuration is designed—these are all intricate details that can be decisive in the selection process, pin by pin.
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