Scalable and robust PCB connections in SMT

The Zero8 series of SMT PCB connectors reliably connect printed circuit boards at data transfer rates of 16 Gbit/s.
Zero8 grp mit Zero8Logo

Features

  • Pitch: 0.8 mm
  • Operating current: 1.7 A
  • 16 Gbps
  • 500 mating cycles
  • Fully scalable
  • Maximum contact reliability
  • Optimized misinsertion protection
  • Packaged in tape & reel

Applications

  • Board-to-board (mezzanine) from 6 to 21 mm;
  • parallel and right-angle connections;
  • shielded and unshielded versions
Filter
The Zero8 products are available for a PCB spacing of 6-21 mm. We will be happy to help you.
Straight shielded plug

Zero8 Mid-Profile Shielded Plug Part No. 405-53112-51

Zero8 12polig Plug Mid Geschirmt Foto
Height: 2.65 mm, Contact overlap: 1.5 mm, 12 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Mid-Profile Shielded Plug Part No. 405-53112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Mid-Profile Shielded Plug Part No. 405-53120-51

Zero8 20polig Plug Mid Geschirmt Foto
Height: 2.65 mm, Contact overlap: 1.5 mm, Pitch 20 in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Mid-Profile Shielded Plug Part No. 405-53120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Mid-Profile Shielded Plug Part No. 405-53132-51

Zero8 32polig Plug Mid Geschirmt Foto
Height: 2.65 mm, Contact overlap: 1.5 mm, 32 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Mid-Profile Shielded Plug Part No. 405-53132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Mid-Profile Shielded Plug Part No. 405-53152-51

Zero8 52polig Plug Mid Geschirmt Foto
Height: 2.65 mm, Contact overlap: 1.5 mm, 52 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Mid-Profile Shielded Plug Part No. 405-53152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Mid-Profile Shielded Plug Part No. 405-53180-51

Zero8 80polig Plug Mid Geschirmt Foto
Height: 2.65 mm, Contact overlap: 1.5 mm, 80 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Mid-Profile Shielded Plug Part No. 405-53180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Low-Profile Shielded Plug Part No. 405-52112-51

Zero8 12polig Plug Low Geschirmt Foto
Height: 1.15 mm, Contact overlap: 1.5 mm, 12 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Low-Profile Shielded Plug Part No. 405-52112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Low-Profile Shielded Plug Part No. 405-52120-51

Zero8 20polig Plug Low Geschirmt Foto
Height: 1.15 mm, Contact overlap: 1.5 mm, Pitch 20 in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Low-Profile Shielded Plug Part No. 405-52120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Low-Profile Shielded Plug Part No. 405-52132-51

Zero8 32polig Plug Low Geschirmt Foto
Height: 1.15 mm, Contact overlap: 1.5 mm, 32 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Low-Profile Shielded Plug Part No. 405-52132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Low-Profile Shielded Plug Part No. 405-52152-51

Zero8 52polig Plug Low Geschirmt Foto
Height: 1.15 mm, Contact overlap: 1.5 mm, 52 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Low-Profile Shielded Plug Part No. 405-52152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Low-Profile Shielded Plug Part No. 405-52180-51

Zero8 80polig Plug Low Geschirmt Foto
Height: 1.15 mm, Contact overlap: 1.5 mm, 80 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Low-Profile Shielded Plug Part No. 405-52180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Plug, High-Profile, Shielded Part No. 405-54112-51

Zero8 12polig Plug High Geschirmt Foto
Height: 7.15 mm, Contact overlap: 1.5 mm, 12 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Plug, High-Profile, Shielded Part No. 405-54112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Plug, High-Profile, Shielded Part No. 405-54120-51

Zero8 20polig Plug High Geschirmt Foto
Height: 7.15 mm, Contact overlap: 1.5 mm, Pitch 20 in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Plug, High-Profile, Shielded Part No. 405-54120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Plug, High-Profile, Shielded Part No. 405-54132-51

Zero8 32polig Plug High Geschirmt Foto
Height: 7.15 mm, Contact overlap: 1.5 mm, 32 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Plug, High-Profile, Shielded Part No. 405-54132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Plug, High-Profile, Shielded Part No. 405-54152-51

Zero8 52polig Plug High Geschirmt Foto
Height: 7.15 mm, Contact overlap: 1.5 mm, 52 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Plug, High-Profile, Shielded Part No. 405-54152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Plug, High-Profile, Shielded Part No. 405-54180-51

Zero8 80polig Plug High Geschirmt Foto
Height: 7.15 mm, Contact overlap: 1.5 mm, 80 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Plug, High-Profile, Shielded Part No. 405-54180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Plug X-High-Profile Shielded Part No. 405-55112-51

Zero8 12polig Plug x High geschirmt normal Foto
Height: 8.65 mm, Contact overlap: 1.5 mm, 12 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
EMC
Zero8 Plug X-High-Profile Shielded Part No. 405-55112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Plug X-High-Profile Shielded Part No. 405-55120-51

Zero8 20polig Plug x High geschirmt normal Foto
Height: 8.65 mm, Contact overlap: 1.5 mm, Pitch 20 in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
EMC
Zero8 Plug X-High-Profile Shielded Part No. 405-55120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Plug X-High-Profile Shielded Part No. 405-55132-51

Zero8 32polig Plug x High geschirmt normal Foto
Height: 8.65 mm, Contact overlap: 1.5 mm, 32 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
EMC
Zero8 Plug X-High-Profile Shielded Part No. 405-55132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Plug X-High-Profile Shielded Part No. 405-55152-51

Zero8 52polig Plug x High geschirmt normal Foto
Height: 8.65 mm, Contact overlap: 1.5 mm, 52 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
EMC
Zero8 Plug X-High-Profile Shielded Part No. 405-55152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Plug X-High-Profile Shielded Part No. 405-55180-51

Zero8 80polig Plug x High geschirmt normal Foto
Height: 8.65 mm, Contact overlap: 1.5 mm, 80 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
EMC
Zero8 Plug X-High-Profile Shielded Part No. 405-55180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe
Straight shielded socket

Zero8 Mid-Profile Shielded Socket Part No. 406-53112-51

Zero8 12polig Socket Mid Geschirmt Foto
Height: 7.85 mm, Contact overlap: 1.5 mm, 12 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Mid-Profile Shielded Socket Part No. 406-53112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Mid-Profile Shielded Socket Part No. 406-53120-51

Zero8 20polig Socket Mid Geschirmt Foto
Height: 7.85 mm, Contact overlap: 1.5 mm, Pitch 20 in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Mid-Profile Shielded Socket Part No. 406-53120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Mid-Profile Shielded Socket Part No. 406-53132-51

Zero8 32polig Socket Mid Geschirmt Foto
Height: 7.85 mm, Contact overlap: 1.5 mm, 32 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Mid-Profile Shielded Socket Part No. 406-53132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Mid-Profile Shielded Socket Part No. 406-53152-51

Zero8 52polig Socket Mid Geschirmt Foto
Height: 7.85 mm, Contact overlap: 1.5 mm, 52 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Mid-Profile Shielded Socket Part No. 406-53152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 Mid-Profile Shielded Socket Part No. 406-53180-51

Zero8 80polig Socket Mid Geschirmt Foto
Height: 7.85 mm, Contact overlap: 1.5 mm, 80 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 Mid-Profile Shielded Socket Part No. 406-53180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 low-profile shielded socket Part No. 406-52112-51

Zero8 12polig Socket Low Geschirmt Foto
Height: 4.85 mm, Contact overlap: 1.5 mm, 12 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 low-profile shielded socket Part No. 406-52112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 low-profile shielded socket Part No. 406-52120-51

Zero8 20polig Socket Low Geschirmt Foto
Height: 4.85 mm, Contact overlap: 1.5 mm, Pitch 20 in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 low-profile shielded socket Part No. 406-52120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 low-profile shielded socket Part No. 406-52132-51

Zero8 32polig Socket Low Geschirmt Foto
Height: 4.85 mm, Contact overlap: 1.5 mm, 32 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 low-profile shielded socket Part No. 406-52132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 low-profile shielded socket Part No. 406-52152-51

Zero8 52polig Socket Low Geschirmt Foto
Height: 4.85 mm, Contact overlap: 1.5 mm, 52 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 low-profile shielded socket Part No. 406-52152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 low-profile shielded socket Part No. 406-52180-51

Zero8 80polig Socket Low Geschirmt Foto
Height: 4.85 mm, Contact overlap: 1.5 mm, 80 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 low-profile shielded socket Part No. 406-52180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 high-profile shielded socket Part No. 406-54112-51

Zero8 12polig Socket High Geschirmt Foto
Height: 10.85 mm, Contact overlap: 1.5 mm, 12 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 high-profile shielded socket Part No. 406-54112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 high-profile shielded socket Part No. 406-54120-51

Zero8 20polig Socket High Geschirmt Foto
Height: 10.85 mm, Contact overlap: 1.5 mm, Pitch 20 in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 high-profile shielded socket Part No. 406-54120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 high-profile shielded socket Part No. 406-54132-51

Zero8 32polig Socket High Geschirmt Foto
Height: 10.85 mm, Contact overlap: 1.5 mm, 32 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 high-profile shielded socket Part No. 406-54132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 high-profile shielded socket Part No. 406-54152-51

Zero8 52polig Socket High Geschirmt Foto
Height: 10.85 mm, Contact overlap: 1.5 mm, 52 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 high-profile shielded socket Part No. 406-54152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 high-profile shielded socket Part No. 406-54180-51

Zero8 80polig Socket High Geschirmt Foto
Height: 10.85 mm, Contact overlap: 1.5 mm, 80 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 high-profile shielded socket Part No. 406-54180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe
Angled, shielded plug

Zero8 angled shielded plug Part No. 405-51112-51

Zero8 12polig Plug gewinkelt geschirmt Foto
90° angled, Contact overlap: 1.5 mm, 12 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 angled shielded plug Part No. 405-51112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled shielded plug Part No. 405-51120-51

Zero8 20polig Plug gewinkelt geschirmt Foto
90° angled, Contact overlap: 1.5 mm, Pitch 20 in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 angled shielded plug Part No. 405-51120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled shielded plug Part No. 405-51132-51

Zero8 32polig Plug gewinkelt geschirmt Foto
90° angled, Contact overlap: 1.5 mm, 32 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 angled shielded plug Part No. 405-51132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled shielded plug Part No. 405-51152-51

Zero8 52polig Plug gewinkelt geschirmt Foto
90° angled, Contact overlap: 1.5 mm, 52 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 angled shielded plug Part No. 405-51152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled shielded plug Part No. 405-51180-51

Zero8 80polig Plug gewinkelt geschirmt Foto
90° angled, Contact overlap: 1.5 mm, 80 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 angled shielded plug Part No. 405-51180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe
Angled shielded socket

Zero8 angled shielded socket Part No. 406-51112-51

Zero8 12polig Socket gewinkelt geschirmt Foto
90° angled, Contact overlap: 1.5 mm, 12 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
EMC
Zero8 angled shielded socket Part No. 406-51112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled shielded socket Part No. 406-51120-51

Zero8 20polig Socket gewinkelt geschirmt Foto
90° angled, Contact overlap: 1.5 mm, Pitch 20 in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
EMC
Zero8 angled shielded socket Part No. 406-51120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled shielded socket Part No. 406-51132-51

Zero8 32polig Socket gewinkelt geschirmt Foto
90° angled, Contact overlap: 1.5 mm, 32 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
EMC
Zero8 angled shielded socket Part No. 406-51132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled shielded socket Part No. 406-51152-51

Zero8 52polig Socket gewinkelt geschirmt Foto
90° angled, Contact overlap: 1.5 mm, 52 teeth in a 0.8 mm pitch, SMT Connectivity, EMC shielding, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
EMC
Zero8 angled shielded socket Part No. 406-51152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled shielded socket Part No. 406-51180-51

Zero8 80polig Socket gewinkelt geschirmt Foto
90° angled, Contact overlap: 1.5 mm, 80 poles in a 0.8 mm grid, SMT Connectivity, EMC shielding, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
EMC
Zero8 angled shielded socket Part No. 406-51180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe
Straight, unshielded plug

Zero8 low-profile unshielded plug Part No. 405-52012-51

Zero8 12polig Plug Low Ungeschirmt Foto
Height: 1.15 mm, Contact overlap: 1.5 mm, Number of poles: 12, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 low-profile unshielded plug Part No. 405-52012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 low-profile unshielded plug Part No. 405-52020-51

Zero8 20polig Plug Low Ungeschirmt Foto
Height: 1.15 mm, Contact overlap: 1.5 mm, Number of poles: 20, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 low-profile unshielded plug Part No. 405-52020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 low-profile unshielded plug Part No. 405-52032-51

Zero8 32polig Plug Low Ungeschirmt Foto
Height: 1.15 mm, Contact overlap: 1.5 mm, Number of poles: 32, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 low-profile unshielded plug Part No. 405-52032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 low-profile unshielded plug Part No. 405-52052-51

Zero8 52polig Plug Low Ungeschirmt Foto
Height: 1.15 mm, Contact overlap: 1.5 mm, Number of poles: 52, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 low-profile unshielded plug Part No. 405-52052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 low-profile unshielded plug Part No. 405-52080-51

Zero8 80polig Plug Low Ungeschirmt Foto
Height: 1.15 mm, Contact overlap: 1.5 mm, Number of poles: 80, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 low-profile unshielded plug Part No. 405-52080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 mid-profile unshielded plug Part No. 405-53012-51

Zero8 12polig Plug Mid Ungeschirmt Foto
Height: 2.65 mm, Contact overlap: 1.5 mm, Number of poles: 12, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 mid-profile unshielded plug Part No. 405-53012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 mid-profile unshielded plug Part No. 405-53020-51

Zero8 20polig Plug Mid Ungeschirmt Foto
Height: 2.65 mm, Contact overlap: 1.5 mm, Number of poles: 20, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 mid-profile unshielded plug Part No. 405-53020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 mid-profile unshielded plug Part No. 405-53032-51

Zero8 32polig Plug Mid Ungeschirmt Foto
Height: 2.65 mm, Contact overlap: 1.5 mm, Number of poles: 32, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 mid-profile unshielded plug Part No. 405-53032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 mid-profile unshielded plug Part No. 405-53052-51

Zero8 52polig Plug Mid Ungeschirmt Foto
Height: 2.65 mm, Contact overlap: 1.5 mm, Number of poles: 52, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 mid-profile unshielded plug Part No. 405-53052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 mid-profile unshielded plug Part No. 405-53080-51

Zero8 80polig Plug Mid Ungeschirmt Foto
Height: 2.65 mm, Contact overlap: 1.5 mm, Number of poles: 80, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 mid-profile unshielded plug Part No. 405-53080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 high-profile unshielded plug Part No. 405-54012-51

Zero8 12polig Plug High ungeschirmt Foto
Height: 7.15 mm, Contact overlap: 1.5 mm, Number of poles: 12, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 high-profile unshielded plug Part No. 405-54012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 high-profile unshielded plug Part No. 405-54020-51

Zero8 20polig Plug High ungeschirmt Foto
Height: 7.15 mm, Contact overlap: 1.5 mm, Number of poles: 20, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 high-profile unshielded plug Part No. 405-54020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 high-profile unshielded plug Part No. 405-54032-51

Zero8 32polig Plug High ungeschirmt Foto
Height: 7.15 mm, Contact overlap: 1.5 mm, Number of poles: 32, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 high-profile unshielded plug Part No. 405-54032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 high-profile unshielded plug Part No. 405-54052-51

Zero8 52polig Plug High ungeschirmt Foto
Height: 7.15 mm, Contact overlap: 1.5 mm, Number of poles: 52, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 high-profile unshielded plug Part No. 405-54052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 high-profile unshielded plug Part No. 405-54080-51

Zero8 80polig Plug High ungeschirmt Foto
Height: 7.15 mm, Contact overlap: 1.5 mm, Number of poles: 80, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 high-profile unshielded plug Part No. 405-54080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 plug, x-high-profile, unshielded Part No. 405-55012-51

Zero8 12polig Plug x High ungeschirmt normal Foto
Height: 8.65 mm, Contact overlap: 1.5 mm, Number of poles: 12, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
Zero8 plug, x-high-profile, unshielded Part No. 405-55012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 plug, x-high-profile, unshielded Part No. 405-55020-51

Zero8 20polig Plug x High ungeschirmt normal Foto
Height: 8.65 mm, Contact overlap: 1.5 mm, Number of poles: 20, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
Zero8 plug, x-high-profile, unshielded Part No. 405-55020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 plug, x-high-profile, unshielded Part No. 405-55032-51

Zero8 32polig Plug x High ungeschirmt normal Foto
Height: 8.65 mm, Contact overlap: 1.5 mm, Number of poles: 32, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
Zero8 plug, x-high-profile, unshielded Part No. 405-55032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 plug, x-high-profile, unshielded Part No. 405-55052-51

Zero8 52polig Plug x High ungeschirmt normal Foto
Height: 8.65 mm, Contact overlap: 1.5 mm, Number of poles: 52, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
Zero8 plug, x-high-profile, unshielded Part No. 405-55052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 plug, x-high-profile, unshielded Part No. 405-55080-51

Zero8 80polig Plug x High ungeschirmt normal Foto
Height: 8.65 mm, Contact overlap: 1.5 mm, Number of poles: 80, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
Zero8 plug, x-high-profile, unshielded Part No. 405-55080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe
Straight, unshielded socket

Zero8 low-profile unshielded socket Part No. 406-52012-51

Zero8 12polig Socket Low Ungeschirmt Foto
Height: 4.85 mm, Contact overlap: 1.5 mm, Number of poles: 12, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 low-profile unshielded socket Part No. 406-52012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 low-profile unshielded socket Part No. 406-52020-51

Zero8 20polig Socket Low Ungeschirmt Foto
Height: 4.85 mm, Contact overlap: 1.5 mm, Number of poles: 20, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 low-profile unshielded socket Part No. 406-52020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 low-profile unshielded socket Part No. 406-52032-51

Zero8 32polig Socket Low Ungeschirmt Foto
Height: 4.85 mm, Contact overlap: 1.5 mm, Number of poles: 32, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 low-profile unshielded socket Part No. 406-52032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 low-profile unshielded socket Part No. 406-52052-51

Zero8 52polig Socket Low Ungeschirmt Foto
Height: 4.85 mm, Contact overlap: 1.5 mm, Number of poles: 52, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 low-profile unshielded socket Part No. 406-52052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 low-profile unshielded socket Part No. 406-52080-51

Zero8 80polig Socket Low Ungeschirmt Foto
Height: 4.85 mm, Contact overlap: 1.5 mm, Number of poles: 80, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 low-profile unshielded socket Part No. 406-52080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 mid-profile unshielded socket Part No. 406-53012-51

Zero8 12polig Socket Mid Ungeschirmt Foto
Height: 7.85 mm, Contact overlap: 1.5 mm, Number of poles: 12, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 mid-profile unshielded socket Part No. 406-53012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 mid-profile unshielded socket Part No. 406-53020-51

Zero8 20polig Socket Mid Ungeschirmt Foto
Height: 7.85 mm, Contact overlap: 1.5 mm, Number of poles: 20, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 mid-profile unshielded socket Part No. 406-53020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 mid-profile unshielded socket Part No. 406-53032-51

Zero8 32polig Socket Mid Ungeschirmt Foto
Height: 7.85 mm, Contact overlap: 1.5 mm, Number of poles: 32, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 mid-profile unshielded socket Part No. 406-53032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 mid-profile unshielded socket Part No. 406-53052-51

Zero8 52polig Socket Mid Ungeschirmt Foto
Height: 7.85 mm, Contact overlap: 1.5 mm, Number of poles: 52, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 mid-profile unshielded socket Part No. 406-53052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 mid-profile unshielded socket Part No. 406-53080-51

Zero8 80polig Socket Mid Ungeschirmt Foto
Height: 7.85 mm, Contact overlap: 1.5 mm, Number of poles: 80, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 mid-profile unshielded socket Part No. 406-53080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 high-profile unshielded socket Part No. 406-54012-51

Zero8 12polig Socket High Ungeschirmt Foto
Height: 10.85 mm, Contact overlap: 1.5 mm, Number of poles: 12, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 high-profile unshielded socket Part No. 406-54012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 high-profile unshielded socket Part No. 406-54020-51

Zero8 20polig Socket High Ungeschirmt Foto
Height: 10.85 mm, Contact overlap: 1.5 mm, Number of poles: 20, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 high-profile unshielded socket Part No. 406-54020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 high-profile unshielded socket Part No. 406-54032-51

Zero8 32polig Socket High Ungeschirmt Foto
Height: 10.85 mm, Contact overlap: 1.5 mm, Number of poles: 32, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 high-profile unshielded socket Part No. 406-54032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 high-profile unshielded socket Part No. 406-54052-51

Zero8 52polig Socket High Ungeschirmt Foto
Height: 10.85 mm, Contact overlap: 1.5 mm, Number of poles: 52, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 high-profile unshielded socket Part No. 406-54052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 high-profile unshielded socket Part No. 406-54080-51

Zero8 80polig Socket High Ungeschirmt Foto
Height: 10.85 mm, Contact overlap: 1.5 mm, Number of poles: 80, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 high-profile unshielded socket Part No. 406-54080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 21.0 mm
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe
Angled, unshielded plug

Zero8 angled unshielded plug Part No. 405-51012-51

Zero8 12polig Plug gewinkelt ungeschirmt Foto
90° angled, Contact overlap: 1.5 mm, Number of poles: 12, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 angled unshielded plug Part No. 405-51012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled unshielded plug Part No. 405-51020-51

Zero8 20polig Plug gewinkelt ungeschirmt Foto
90° angled, Contact overlap: 1.5 mm, Number of poles: 20, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 angled unshielded plug Part No. 405-51020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled unshielded plug Part No. 405-51032-51

Zero8 32polig Plug gewinkelt ungeschirmt Foto
90° angled, Contact overlap: 1.5 mm, Number of poles: 32, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 angled unshielded plug Part No. 405-51032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled unshielded plug Part No. 405-51052-51

Zero8 52polig Plug gewinkelt ungeschirmt Foto
90° angled, Contact overlap: 1.5 mm, Number of poles: 52, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 angled unshielded plug Part No. 405-51052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled unshielded plug Part No. 405-51080-51

Zero8 80polig Plug gewinkelt ungeschirmt Foto
90° angled, Contact overlap: 1.5 mm, Number of poles: 80, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 angled unshielded plug Part No. 405-51080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe
Angled, unshielded socket

Zero8 angled, unshielded socket Part No. 406-51012-51

Zero8 12polig Socket gewinkelt ungeschirmt Foto
90° angled, Contact overlap: 1.5 mm, Number of poles: 12, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 angled, unshielded socket Part No. 406-51012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled, unshielded socket Part No. 406-51020-51

Zero8 20polig Socket gewinkelt ungeschirmt Foto
90° angled, Contact overlap: 1.5 mm, Number of poles: 20, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 angled, unshielded socket Part No. 406-51020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled, unshielded socket Part No. 406-51032-51

Zero8 32polig Socket gewinkelt ungeschirmt Foto
90° angled, Contact overlap: 1.5 mm, Number of poles: 32, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 angled, unshielded socket Part No. 406-51032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled, unshielded socket Part No. 406-51052-51

Zero8 52polig Socket gewinkelt ungeschirmt Foto
90° angled, Contact overlap: 1.5 mm, Number of poles: 52, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 angled, unshielded socket Part No. 406-51052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 angled, unshielded socket Part No. 406-51080-51

Zero8 80polig Socket gewinkelt ungeschirmt Foto
90° angled, Contact overlap: 1.5 mm, Number of poles: 80, SMT Connectivity, Grid 0.8 mm, Performance Level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
Zero8 angled, unshielded socket Part No. 406-51080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact Materialcopper alloy
PlatingAbove Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500 insertion cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10–2000 Hz, 20 g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50 g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs
Overmating Distance0.8 mm
Wipe lenght1.5 mm
Center offset± 0.7 mm
Axial offset when mated (x/y)± 0.4 mm
Angular offset± 5°

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins powered)
5.5 A per pin at 20°C (2 of 80 pins powered)
5.1 A per pin at 20°C (4 of 80 pins powered)
16 A at 20°C (shield powered)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20–40 seconds at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
Stock Check
You will be redirected to an external page with the Supplyframe offer. By loading the content you accept the data processing by Supplyframe.
You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe
Other number of contacts? Other stacking heights? alternative plating? Individual assembly? Lagging contacts?
» Not the right one for you? Request a customized connector now!
Thank you very much! We will review your request and get back to you.

If you have any questions, please feel free to contact us by email or phone at any time.

No matching product found - Request this product now:

Fields marked with * are required.
You can view our privacy policy here.

Key Features of the zero8 Connector with ScaleX Technology

± 0.4 mm tolerance compensation when assembled

Zero8 Winkelversatz Pfeile
  • 1.5 mm overlap in the
  • X and Y directions; in the Z direction

High-speed data transfer at a minimum of 16+ Gbit/s

Zero8 Highspeed Darstellung
  • Suitable for PCIe 4.0 and Industrial
  • Ethernet. Additional signal protection provided by shielding.

What are the benefits of the new ScaleX technology?

How does dual-sided contact work?
What data rates can you achieve with zero8 connectors? What are the benefits of the closed-shield design?
How flexible is your device design with zero8 connectors? You’ll

find the answers to your questions in this short animated video. Check it out right here (or on YouTube)!

Features of the 0.8 mm SMT connectors with ScaleX technology

Steckverbinderentwicklung PxC ept rgb rot
ScaleX – this brand stands for robust, double-sided contact technology in a flexibly scalable connector system.

Our zero8 series spring-contact connectors deliver particularly reliable contact thanks to ScaleX. This makes them ideal for applications in demanding industrial sectors. Even continuous stress, such as that caused by vibrations and shocks, is no problem for these high-quality German connectors. At the same time, you enjoy full flexibility thanks to the scalability of the board-to-board connectors.
image
Zero SMT Socket

Details at a Glance

image
Anti-twist protection

to ensure proper connection between the plug and socket

image
Lead-in chamfers

to compensate for axial and angular misalignment during assembly

image
Boardlock

for a secure connection to the circuit board

image
Coding pin

to ensure the connector is properly positioned on the circuit board

image
Coplanarity

for reliable soldering during processing

image
Meniscus formation

for high stability and strength of the solder joint

image
Zero SMT Plug

Details at a Glance

image
Double-sided contact system

for reliable electrical contact in industrial environments (shock, vibration, thermal cycling, corrosive gases)

image
Smooth contact surface

The contact points on the homogeneous rolled side with high-quality surfaces enable 500 mating cycles.

image
Protected contacts

Optimized contact and housing geometry reduces damage to the contacts

image
Data flow

HF-optimized contact geometry ensures data rates of 16 Gbit/s

image
EMC shielding

Double-sided shielding ensures high electromagnetic compatibility for optimal signal integrity in industrial environments

image
Tolerance compensation

High reliability due to high tolerance compensation

Gender-neutral contact system:
Double-sided contact for maximum contact reliability in SMT connectors

Unlike conventional SMD connectors, which establish contact via a blade contact and a spring contact, our shielded Zero8 board-to-board connector features both a blade contact and a spring contact on each connector pair (plug or socket). This reliable connection technology ensures dual contact on a single pin, providing high redundancy and thus maximum contact reliability. As a result, the gender-neutral contact system ensures a secure, robust, and gas-tight connection despite external influences such as shocks, vibrations, thermal cycling, and corrosive gases. The very high tolerance compensation of 0.4 mm when mated, made possible by the gender-neutral contact system of the zero8 connector, also makes the connector particularly scalable.

The geometry of the insulating housing is also designed so that the contacts are recessed within the insulating body, thereby protecting them to the extent that damage to the contacts is virtually impossible. Furthermore, the geometry reliably prevents incorrect mating of the contacts.

Flexible PCB Spacing:
The Right Connectors for Every Need

Our PCB connectors are robust and provide excellent tolerance compensation. Whether during installation or when plugged in, these SMT connectors adapt to your specific requirements. They even readily forgive incorrect handling. Whatever you’re planning, you can count on Zero8 connectors.
Zero8 Leiterplattenabstaende NEU
The multi-pin connectors from ept do not need to be inserted all the way to the stop. Thanks to a 2.3 mm over-insertion range, ept connectors fit perfectly into your applications. The plug and socket can be inserted variably within a range of 1.5 mm without affecting data transmission. Depending on requirements, PCB spacing from 6.00 to 21.00 mm can be accommodated.
Flexible Leiterplattenabstaende 2
Inserting the plug all the way ensures the minimum possible PCB spacing. For the maximum possible spacing, insert the plug and socket only 0.8 mm into each other. This contact area is sufficient to ensure a fast and secure connection.

Zero8 PCB connectors specified according to PICMG Modblox7

PICMG Logo
ModBlox7 defines the basic specification for a modular box PC consisting of various functional modules, such as the CPU, power supply, and I/Os. This new, vendor-neutral standard enables users to implement a wide range of device combinations in a modular design through interoperable functional units. The PICMG® also aimed to reduce costs and promote sustainability. The new PICMG® specification covers the mechanical design, the modular functional units, and the electrical connections via connectors with a predefined pinout.

A box PC consists of a chassis, one or two power supply units, and one or two CPUs, each with up to four PCI Express and up to eight USB-based I/Os. Each module, in turn, can comprise up to three stacked circuit boards, depending on the unit’s complexity. The dimensions of the box PC are specified in terms of height and depth. The front width, however, varies depending on the number of units. These, in turn, can each consist of one or more so-called 1.4-inch slots. Twelve slots can thus be arranged in a row up to a maximum width of 16.8 inches. In a standard for

modular device configuration, special attention is naturally paid to the electrical and mechanical connection of the individual modules via connectors. In line with the operating conditions of box PCs, the zero8 is a high-speed-capable SMT connector that is characterized not only by its exceptional robustness during installation but also by high tolerances during operation and outstanding resistance to adverse environmental conditions. Since some applications require an additional connector to ensure reliability through redundancy, it must also be possible to use multiple connectors simultaneously on a single PCB. This requires high misalignment compensation during mating as well as operational tolerances. The Zero8 PCB connector possesses all these characteristics.

PCB Connectors:
EMC Shielding for the Highest Quality PCB Connections

As installation density increases, so does the risk of mutual electromagnetic interference. To prevent this, shielded connectors are used, which offer better electromagnetic compatibility (EMC). EMC is crucial for the interference-free operation of electrical components and applications.
Platinen Steckverbinder 1
Our Zero8 board-to-board connectors feature double-sided shielding, ensuring optimal EMC performance. This guarantees interference-free data transmission in virtually any environment. The shielding material used is specifically designed for components with high electromagnetic compatibility requirements. This guarantees a maximum coupling inductance of 10 picohenries. This makes the PCB connectors in the Zero8 family the ideal choice for applications in Industry 4.0 and the Internet of Things.
Platinen Steckverbinder 2
The large-area shielding design reliably diverts interference currents toward the ground connection via multiple contact points on both circuit boards. The effects of electric and magnetic field strength on the PCB connectors can be clearly simulated using coupling inductance. Conversely, in cases where the connector could act as a source of interference, adjacent components and parts are effectively protected.
Motive Web Kurzbeschreibung Kontakt 1640x1195px
We manufacture custom-fit, custom connectors tailored to your application.
  • Other pin counts
  • Other stack heights
  • Alternative contact coatings

Request a custom connector now

Zero8 SMT PCB Connectors for Industrial Applications

leiterplatten steckverbinder
Are you looking for a shielded SMT connector that is rugged and provides reliable contact? Ideally, one that can also be scaled to meet your specific requirements?

Our Zero8 PCB connector product family with a 0.8 mm pitch was developed for demanding industrial applications and offers maximum scalability. Freely customize the form factor, number of pins

, and stack height of the SMT connectors to meet your specific requirements. Our PCB connectors guarantee a data transfer rate of 16 Gbit/s. The PCB connection can be implemented in parallel, right-angle, or horizontal configurations. We offer sockets and plugs in low-, mid-, and high-profile as well as angled versions; the plug is also available in an x-high-profile version.
Thanks to the various mounting heights, zero8 board-to-board connectors allow you to achieve PCB spacing of 6.00 to 21.00 mm. The ept connectors are available in 12-pin to 80-pin versions. You also have the option of selecting shielding. You can specify both sides of the connector pair with or without shielding, or opt for shielding on only one side; all Zero8 connectors are fully plug-compatible and can be combined freely, regardless of the shielding configuration.

FAQ: Questions and Answers About Zero8 SMT PCB Connectors

How can Zero8 SMT PCB connectors be assembled?In what ways can printed circuit boards be connected to each other using Zero8 SMT connectors?What types of currents can be transmitted using Zero8 connectors?What makes the new connection concept stand out?What does ScaleX technology stand for?What data transfer rates are the Zero8 SMT connectors suitable for?For which applications is the shielded version suitable?Does the Zero8's connection design account for tolerances in my application?
How can Zero8 SMT PCB connectors be assembled?

The Zero8 connector system is manufactured using surface mount technology (SMT) and is therefore soldered directly onto printed circuit boards. The connectors are typically shipped in tape-and-reel packaging, which enables fully automated pick-and-place assembly. Positioning pins on the underside of the Zero8 connectors ensure precise positioning on the printed circuit board. ept also guarantees a maximum contact coplanarity of 0.1 mm to ensure reliable soldering during processing.

In what ways can printed circuit boards be connected to each other using Zero8 SMT connectors?

The various designs in the zero8 connector family allow for the connection of printed circuit boards (PCBs) in parallel configurations with stack heights ranging from 6 to 21 mm, as well as in horizontal or right-angle configurations.

Zero8 Leiterplattenabstaende NEU
What types of currents can be transmitted using Zero8 connectors?

Thanks to the high-quality copper alloy with excellent conductivity, a 50-pin connector can handle up to 1.7 A at an ambient temperature of 20°C. These values are typically achieved with connectors that have a pitch of at least 1.27 mm.

What makes the new connection concept stand out?

Each connector pair (plug or socket) includes both a blade contact and a spring contact. This dual-contact design ensures a secure and gas-tight connection in industrial environments and is resistant to external influences such as shock, vibration, thermal cycling, and corrosive
gases. The contact on the homogeneous rolled surface with high-quality finishes guarantees at least 500 mating cycles and reduces surface abrasion caused by micro-movements.

What does ScaleX technology stand for?

The ScaleX technology brand highlights the scalability of the connector system in practical applications and the advantages of the contact technology:

Reliable mechanical and electrical connections thanks to a double-sided contact system

Flexible device design: various pin counts, form factors, and stack heights with high mis-insertion protection

Versatility: Board-to-board connectors in shielded and unshielded versions

Robustness: Connection technology for high tolerance compensation and contact protection

Data rates up to 16 Gbit/s: optionally with a closed shielding concept for high EMC protection

Logo ScaleX rgb
What data transfer rates are the Zero8 SMT connectors suitable for?

Simulations using the Zero8 connector system at 16 Gbit/s demonstrate excellent signal integrity. The S-parameters can be provided for your application simulations; please feel free to contact us at sales@ept.de

For which applications is the shielded version suitable?

The shielding concept ensures optimal electromagnetic compatibility (EMC) in industrial applications and is suitable for all devices with internal high-speed data transmission that are classified as sources of interference and/or sinks of interference:
frequency converters, power supplies, UPS systems, electric drives, switchgear, control systems, I/O systems, medical devices, measurement technology, communication systems, network technology, sensors, and video transmission equipment.

Does the Zero8's connection design account for tolerances in my application?

The newly developed connection design ensures a high degree of tolerance compensation during installation (angular misalignment of up to 5°, center misalignment of ±0.7 mm) and compensates for device-side tolerances of ±0.4 mm in the x and y directions and 1.5 mm in the z direction even when the devices are connected.

Zero8 Mitten Winkelversatz 2023

Your message has been sent.

Thank you for your interest—we will process your request as soon as possible.

Contact Form

Fields marked with * are required.

Personal information

Recall

Your message

I am interested in

Information materials

Privacy Policy

You can view our privacy policy here.

Thank you very much!

We will be in touch shortly to discuss your requirements. We will prepare and send you a detailed report on the high-speed characteristics as well as S-parameters for simulating your own design.

Request high-speed specifications and S-parameters to simulate your own design

Fields marked with * are required.
You can view our privacy policy here.

Thank you very much for your interest

You can download the white paper here:

Download the white paper

Before you can download the white paper, please fill out the following fields. Thank you.

Fields marked with * are required.

Personal information

Would you like to send us more information?

I am interested in

Privacy Policy

You can view our privacy policy here.

Thank you for your inquiry

We will review your request and get back to you as soon as possible.

Request a quote for custom connectors

Fields marked with an * are required; please fill them in.

Contact person

Your request

Wrong file format! Please select a PDF or JPG file.
You can view our privacy policy here.

Thank you for your inquiry

We will review your request and get back to you as soon as possible.

Your requirements for the connector

Fields marked with an * are required; please fill them in.

Contact person

Your request

Wrong file format! Please select a PDF or JPG file.
You can view our privacy policy here.