Float27 Spring Strip x²high-profile Part No. 424-56080-51
Illustration similar
Parallel
Perpendicular
Float
SMT
High Density
Rugged
- Number of poles: 80
- Height (unassembled): 24.35 mm
- Can be combined for PCB spacing of 26.1–30.7 mm
- SMT Connectivity
- Grid: 1.27 mm
- Performance Level 1
Technical Specifications
Basics
| No. of Contacts | 80 |
|---|---|
| Termination Technology | SMT |
| Board-to-Board Distance | 26.1–30.7 mm |
| Operating Temperature Range | -55°C to +125°C |
Material
| Insulator Material | LCP, UL 94 V-0 |
|---|---|
| CTI value IEC 60112 | 175 |
| Contact Material | copper alloy |
| Plating | Au over PdNi over Ni |
| Termination area | Sn over Ni |
Mechanical
| Pitch | 1.27 mm |
|---|---|
| Mating Force per Pin | ≤ 0.5 N |
| Separating Force per Pin | ≥ 0.1 N |
| Durability IEC 60512-9-1 | Grade 1: 500 insertion cycles |
| Coplanarity | ≤ 0.1 mm |
Electrical
| Operational Current IEC 60512-5-2 | 1.8 A at 20°C (2 of 80 pins) 1.4 A at 20°C (4 of 80 pins) 0.9 A at 20°C (80 of 80 pins) |
|---|---|
| Contact Resistance IEC 60512-2-1 | ≤ 95 mΩ |
| Clearance and Creepage | at least 0.45 mm |
| Insulation Resistance IEC 60512-3-1 | ≥ 10 GΩ |
| Test Voltage IEC 60512-4-1 | 500 VDC |
Processing
| Soldering Temperature JEDEC J-STD-020E | 20–40 seconds at 260°C |
|---|---|
| MSL JEDEC J-STD-020E | 1 |
| Assembly | Pick and Place |
Approval / Compliance
| UL file | In progress |
|---|---|
| Environment | RoHS compliant |
Matching Products
Modifications
Available on request
- other pole counts
- other quality grades
- other heights
- variants with special configurations
- Tape-and-reel packaging
Packaging
Tray
15 pieces per tray