HighSpeed edge card connections up to 28 Gbps

The edge card connector principle enables data transmission rates of up to 28 Gbps.
Highspeed mit Pfeile.png

Features

  • Edge card connector
  • 20 to 200 contacts
  • 28 Gbps data transmission rate
  • 3.2 A current carrying capacity
  • 500 insertion cycles
  • Packed in tape & reel, tray
  • 1.60 mm daughter card thickness

Applications

  • Embedded
  • Industrial Automation
  • Datacom
EC.8 - straight

EC.8 straight 20p Part No. 408-52020-000-11

EC8 gerade 20pol ohne key Foto
20 pins, without key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 straight 20p Part No. 408-52020-000-11 - Technical data

Basics

No. of Contacts20
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact MaterialCopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Test Voltage
IEC 60512-4-1
1100 VDC
Data Transfer Rate28 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant

EC.8 straight 40p Part No. 408-52040-000-11

EC8 gerade 40pol ohne key Foto
40 pins, without key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 straight 40p Part No. 408-52040-000-11 - Technical data

Basics

No. of Contacts40
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact MaterialCopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Test Voltage
IEC 60512-4-1
1100 VDC
Data Transfer Rate28 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant

EC.8 straight 60p Part No. 408-52060-000-11

EC8 gerade 60pol ohne key Foto
60 pins, without key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 straight 60p Part No. 408-52060-000-11 - Technical data

Basics

No. of Contacts60
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact MaterialCopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Test Voltage
IEC 60512-4-1
1100 VDC
Data Transfer Rate28 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant

EC.8 straight 60p Part No. 408-52060-100-11

EC8 gerade 60pol mit key Foto
60 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 straight 60p Part No. 408-52060-100-11 - Technical data

Basics

No. of Contacts60
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact MaterialCopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Test Voltage
IEC 60512-4-1
1100 VDC
Data Transfer Rate28 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant

EC.8 straight 80p Part No. 408-52080-100-11

EC8 gerade 80pol mit key Foto
80 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 straight 80p Part No. 408-52080-100-11 - Technical data

Basics

No. of Contacts80
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact MaterialCopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Test Voltage
IEC 60512-4-1
1100 VDC
Data Transfer Rate28 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant

EC.8 straight 100p Part No. 408-52100-100-11

EC8 gerade 100pol mit key Foto
100 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 straight 100p Part No. 408-52100-100-11 - Technical data

Basics

No. of Contacts100
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact MaterialCopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Test Voltage
IEC 60512-4-1
1100 VDC
Data Transfer Rate28 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant

EC.8 straight 120p Part No. 408-52120-100-11

EC8 gerade 120pol mit key Foto
120 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 straight 120p Part No. 408-52120-100-11 - Technical data

Basics

No. of Contacts120
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact MaterialCopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Test Voltage
IEC 60512-4-1
1100 VDC
Data Transfer Rate28 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant

EC.8 straight 140p Part No. 408-52140-100-11

EC8 gerade 140pol mit key Foto
140 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tape & Reel packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 straight 140p Part No. 408-52140-100-11 - Technical data

Basics

No. of Contacts140
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact MaterialCopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Test Voltage
IEC 60512-4-1
1100 VDC
Data Transfer Rate28 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant

EC.8 straight 160p Part No. 408-52160-100-12

EC8 gerade 160pol mit key Foto
160 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tray packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 straight 160p Part No. 408-52160-100-12 - Technical data

Basics

No. of Contacts160
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact MaterialCopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Test Voltage
IEC 60512-4-1
1100 VDC
Data Transfer Rate28 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant

EC.8 straight 180p Part No. 408-52180-100-12

EC8 gerade 180pol mit key Foto
180 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tray packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 straight 180p Part No. 408-52180-100-12 - Technical data

Basics

No. of Contacts180
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact MaterialCopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Test Voltage
IEC 60512-4-1
1100 VDC
Data Transfer Rate28 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant

EC.8 straight 200p Part No. 408-52200-100-12

EC8 gerade 200pol mit key Foto
200 pins, with key, for 1.60 mm edge card thickness, 0.8 mm pitch, data transfer rate 28 Gbps, Tray packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 straight 200p Part No. 408-52200-100-12 - Technical data

Basics

No. of Contacts200
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact MaterialCopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Test Voltage
IEC 60512-4-1
1100 VDC
Data Transfer Rate28 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant

EC.8 straight 200p Part No. 408-52200-103-12

EC8 gerade 200pol mit key Foto
200 pins, with key, strengthened element along insulator, 0.8 mm pitch, data transfer rate 28 Gbps, Tray packaging
Perpendicular
SMT
Direct Connector
High Density
High Speed
EC.8 straight 200p Part No. 408-52200-103-12 - Technical data

Basics

No. of Contacts200
Termination TechnologySMT
Operating Temperature Range-55°C to +125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
200
Contact MaterialCopper alloy
PlatingAu over PdNi over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.635 N
Separating Force per Pin≥ 0.06 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.35 A at 20°C (140 of 140 pins)
3.20 A at 20°C (8 of 140 pins)
Contact Resistance
IEC 60512-2-1
≤ 15 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
≥ 1 GΩ
Test Voltage
IEC 60512-4-1
1100 VDC
Data Transfer Rate28 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS compliant
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EC.8: Direct connector system with high speed at its core

Highspeed mit Pfeile.png
The edge card connector principle enables data transmission rates of up to 28 Gbps.

Edge card connectors have shorter transfer pathways and fewer cross section changes which enhances the signal. A direct contact reduces the resistance and influence on the signal. This positively affects the current capacity and data transfer properties. A lower resistance defines the edge card connection when compared to a similar connector pair.

A detailed report on the high-speed properties as well as simulation parameters for simulating your own design are available on request: sales@ept.de
image
EC.8: Direct connector system

detail overview

image
insertion chamfer

for compensation of misalignment and angular inclination

image
acoustic and haptic feedback

to secure an accurate connection with the edge card

image
coplanarity

soldering under controlled process conditions

image
coding bay

anti-twist safeguard and tolerance compensation for the edge card

image
misalignment pins

prevents misalignment on the board

Edge card connector versus connector pair

The edge card connector enables direct contacting of the PCB without a corresponding mating connector. In comparison to a conventional connector pair, there are fewer contact points and transitions resulting in a positive effect on current carrying capacity and data transmission properties.
image
Edge Card Connector:

[1] R Contact junction
[2] R Contact
[3] R PCB connection
image
Connector Pair:

[1] R PCB connection
[2] R Contact
[3] R Contact junction
[4] R Contact
[5] R PCB connection

Tolerances

image
Center offset in EC.8 edge card connectors
Permitted center offset tolerances

The EC.8 SMT edge card connectors tolerate an offset of 0.6 mm in the longitudinal axis and 0.7 mm in the transversal axis during insertion.
image
Angular offset in EC.8 direct connectors
Permitted angular offset tolerances

With the EC.8 edge card connectors, the daughter card can be inserted in the EC.8 at an angle of up to 5° in the longitudinal axis and transversal axis.

EC.8 SMT edge card connector with 0.8 mm pitch

Produktmanager Jan Lehmann EC8
"Are you looking to achieve maximum power without wasting a lot of space? How about an edge card connector built specifically for HighSpeed applications?

The core design of the EC.8 embodies HighSpeed performance, offering transfer rates of up to 28 Gbps. An ideal connector for Industry 4.0 applications such as IoT and cloud computing.

Besides fast data transfer rates, this edge card connector also offers the following advantages: Connecting a PCB directly to the EC.8 saves space and resources, because of the omitted material and fitting costs for male multi-pin connectors. One technical advantage originates from the reduction of resistances and influences that can have an effect on the signal.
Finding the right edge card connector for you application is easy with our EC.8 and its industry-proven 0.8 mm pitch, available in variations of 20 to 200 pins, in steps of 20.

The EC.8 family underwent comprehensive testing, in which proper operation during thermal cycles, exposure to shock and vibration, and even after 500 mating cycles, was demonstrated.
Want to learn more? Feel free to ask us about the EC.8 HighSpeed report and S-parameters and discover all of its advantages for yourself."

Jan Lehmann, Product Manager ept GmbH

FAQ: Questions and answers about EC.8 direct connectors

How can EC.8 direct connectors be processed?Which specification/layout should be applied when manufacturing the plug-in card?Why should a direct connector system be used?Is the EC.8 connector system compatible with the current daughter card specifications?What applications are EC.8 direct connectors used for?What offset do EC.8 direct connectors tolerate when inserting the daughter card?What data rates can be transmitted?What currents can be transmitted?Are EC.8 connectors UL recognized components?Are the EC.8 connectors RoHS compliant?
How can EC.8 direct connectors be processed?

The direct connectors are processed using surface mount technology (SMT). The soldering is done directly on the printed circuit board.
Pin counts 20 to 140 are supplied in market-compliant tape and reel packaging; this enables fully automatic processing via pick-and-place.
Pin counts 160 to 200 are packed in the tray as standard; tape and reel packaging is also available on request. However, this also uses a wider strap, which is less common.

Which specification/layout should be applied when manufacturing the plug-in card?

Please see the diagram below for details on the chamfering and dimensions of the circuit board. We recommend hard gold for the gold pads. Please refer to the product diagram for further details.

Anphasung EC8
Why should a direct connector system be used?

High data communication rates can be realized using direct connector systems. In comparison to two-part connector systems, the negative effects of the second connector on the signal no longer apply. This is primarily due to the reduced number of contact points, less cross section changes in the conductor and associated fewer direction changes by the signal.
Consequently a high performance can also be attained with a small footprint. The contact resistance is also reduced in comparison to two-part connector systems, this resulting in increased current carrying capacity.

Is the EC.8 connector system compatible with the current daughter card specifications?

The EC.8 connector system supports daughter card systems with a thickness of 1.60 mm. For more than 80 pins, keying prevents incorrect connection. This is optional for the 60 pin version.
The EC.8 connector system corresponds to the current market standard and is compatible with the processed boards.

What applications are EC.8 direct connectors used for?

Thanks to their versatility, EC.8 direct connectors are used for diverse applications in numerous sectors. In the field of automation technology and IoT devices, they typically benefit from their small grid and high data transmission rates.

What offset do EC.8 direct connectors tolerate when inserting the daughter card?

An angular offset of up to 5° can be tolerated in a longitudinal and transverse direction.
An offset of 7 mm vertically and 6 mm parallel to the longitudinal axis of the connector can be tolerated.

EC8 Tolerances
What data rates can be transmitted?

The data transmission rate is 28 Gbps. Below you'll find the insertion loss diagram.

EC8 Insertion loss
What currents can be transmitted?

A 140-pole connector transmits up to 3.2A at 20°C ambient temperature. For more detailed information, please contact us via sales@ept.de

Are EC.8 connectors UL recognized components?

Yes, EC.8 connectors from ept are UL recognized components in the USA and Canada.

Are the EC.8 connectors RoHS compliant?

RoHS (Restriction of the use of certain Hazardous Substances) is a directive for restricting the use of certain hazardous substances in electrical and electronic devices.
We confirm that EC.8 connectors made by ept are compliant with RoHS 2011/65/EU in accordance with the RoHS confirmation. You can find further information at RoHS & REACH