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No. of Contacts | 60 |
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Termination Technology | SMT |
Operating Temperature Range | -55°C to +125°C |
Insulator Material | LCP, UL 94 V-0 |
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CTI value IEC 60112 | 200 |
Contact Material | Copper alloy |
Plating | Au over PdNi over Ni |
Termination area | Sn over Ni |
Pitch | 0.8 mm |
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Mating Force per Pin | ≤ 0.635 N |
Separating Force per Pin | ≥ 0.06 N |
Durability IEC 60512-9-1 | 500 mating cycles |
Coplanarity | ≤ 0.1 mm |
Vibration, sinusoidal IEC 60512-6-4 | 10 - 2000 Hz, 20g |
Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5 | ≤ 1 µs |
Shock, semi-sinusoidal IEC 60512-6-3 | 50g, 11 ms |
Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5 | ≤ 1 µs |
Operational Current IEC 60512-5-2 | 1.35 A at 20°C (140 of 140 pins) 3.20 A at 20°C (8 of 140 pins) |
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Contact Resistance IEC 60512-2-1 | ≤ 15 mΩ |
Clearance and Creepage | 0.25 mm |
Insulation Resistance IEC 60512-3-1 | ≥ 1 GΩ |
Test Voltage IEC 60512-4-1 | 1100 VDC |
Data Transfer Rate | 28 Gbps |
Soldering Temperature JEDEC J-STD-020E | 20 - 40 s at 260°C |
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MSL JEDEC J-STD-020E | 1 |
Assembly | Pick and Place |
UL file | E130314 |
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Environment | RoHS compliant |
For details please download the drawings or contact ept directly.
Plated through-hole according to IEC 60352-5
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