Mail
SearchbackDescriptionTechnical SpecificationsDerating DiagramMatching ProductsPackagingDownloadsStock Check
EC.8 straight 60p Part No. 408-52060-000-11
Illustration similar
Perpendicular
SMT
Direct Connector
High Density
High Speed
- 60 pins
- without key
- for 1.60 mm edge card thickness
- 0.8 mm pitch
- data transfer rate 28 Gbps
- Tape & Reel packaging
Technical Specifications
Basics
| No. of Contacts | 60 |
|---|---|
| Termination Technology | SMT |
| Operating Temperature Range | -40°C to +125°C |
Material
| Insulator Material | LCP, UL 94 V-0 |
|---|---|
| CTI value IEC 60112 | 200 |
| Contact Material | Copper alloy |
| Plating | Au over PdNi over Ni |
| Termination area | Sn over Ni |
Mechanical
| Pitch | 0.8 mm |
|---|---|
| Mating Force per Pin | ≤ 0.635 N |
| Separating Force per Pin | ≥ 0.06 N |
| Durability IEC 60512-9-1 | 500 mating cycles |
| Coplanarity | ≤ 0.1 mm |
| Vibration, sinusoidal IEC 60512-6-4 | 10 - 2000 Hz, 20g |
| Contact mating problems if vibrations occur, sinusoidal IEC 60512-2-5 | ≤ 1 µs |
| Shock, semi-sinusoidal IEC 60512-6-3 | 50g, 11 ms |
| Contact mating problems if shock occur, semi-sinusoidal IEC 60512-2-5 | ≤ 1 µs |
Electrical
| Operational Current IEC 60512-5-2 | 1.35 A at 20°C (140 of 140 pins) 3.20 A at 20°C (8 of 140 pins) |
|---|---|
| Contact Resistance IEC 60512-2-1 | ≤ 15 mΩ |
| Clearance and Creepage | 0.25 mm |
| Insulation Resistance IEC 60512-3-1 | ≥ 1 GΩ |
| Test Voltage IEC 60512-4-1 | 1100 VDC |
| Data Transfer Rate | 28 Gbps |
Processing
| Soldering Temperature JEDEC J-STD-020E | 20 - 40 s at 260°C |
|---|---|
| MSL JEDEC J-STD-020E | 1 |
| Assembly | Pick and Place |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS compliant |
Derating Diagram
