Scalable, Robust PCB Connections in SMT

The SMT PCB connectors of the Zero8 series reliably connect PCBs with data transfer rates of 16 Gbps.
Zero8 grp mit Zero8Logo

Features

  • Pitch: 0.8 mm
  • 16 Gbps
  • 12 to 80 contacts
  • 1.7 A current carrying capacity
  • 500 mating cycles
  • Maximum contact reliability
  • Optimized protection against faulty connection
  • Packed in tape and reel

Applications

  • Board-to-board (mezzanine) of 6–21 mm
  • Parallel and right-angled connections
  • Optional: Unshielded versions
Filter
The Zero8 products are available for a PCB spacing of 6-21 mm. We will be happy to help you.
Plug straight shielded

Zero8 plug low-profile shielded Part No. 405-52112-51

Zero8 12polig Plug Low Geschirmt Foto
12 pins, unmated stacking height: 1.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug low-profile shielded Part No. 405-52112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug low-profile shielded Part No. 405-52120-51

Zero8 20polig Plug Low Geschirmt Foto
20 pins, unmated stacking height: 1.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug low-profile shielded Part No. 405-52120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug low-profile shielded Part No. 405-52132-51

Zero8 32polig Plug Low Geschirmt Foto
32 pins, unmated stacking height: 1.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug low-profile shielded Part No. 405-52132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug low-profile shielded Part No. 405-52152-51

Zero8 52polig Plug Low Geschirmt Foto
52 pins, unmated stacking height: 1.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug low-profile shielded Part No. 405-52152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Stock Check
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Zero8 plug low-profile shielded Part No. 405-52180-51

Zero8 80polig Plug Low Geschirmt Foto
80 pins, unmated stacking height: 1.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug low-profile shielded Part No. 405-52180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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Zero8 plug mid-profile shielded Part No. 405-53112-51

Zero8 12polig Plug Mid Geschirmt Foto
12 pins, unmated stacking height: 2.65 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug mid-profile shielded Part No. 405-53112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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Zero8 plug mid-profile shielded Part No. 405-53120-51

Zero8 20polig Plug Mid Geschirmt Foto
20 pins, unmated stacking height: 2.65 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug mid-profile shielded Part No. 405-53120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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Zero8 plug mid-profile shielded Part No. 405-53132-51

Zero8 32polig Plug Mid Geschirmt Foto
32 pins, unmated stacking height: 2.65 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug mid-profile shielded Part No. 405-53132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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Zero8 plug mid-profile shielded Part No. 405-53152-51

Zero8 52polig Plug Mid Geschirmt Foto
52 pins, unmated stacking height: 2.65 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug mid-profile shielded Part No. 405-53152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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Zero8 plug mid-profile shielded Part No. 405-53180-51

Zero8 80polig Plug Mid Geschirmt Foto
80 pins, unmated stacking height: 2.65 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug mid-profile shielded Part No. 405-53180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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Zero8 plug high-profile shielded Part No. 405-54112-51

Zero8 12polig Plug High Geschirmt Foto
12 pins, unmated stacking height: 7.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug high-profile shielded Part No. 405-54112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu über Ni
Termination areaSn über Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug high-profile shielded Part No. 405-54120-51

Zero8 20polig Plug High Geschirmt Foto
20 pins, unmated stacking height: 7.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug high-profile shielded Part No. 405-54120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug high-profile shielded Part No. 405-54132-51

Zero8 32polig Plug High Geschirmt Foto
32 pins, unmated stacking height: 7.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug high-profile shielded Part No. 405-54132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug high-profile shielded Part No. 405-54152-51

Zero8 52polig Plug High Geschirmt Foto
52 pins, unmated stacking height: 7.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug high-profile shielded Part No. 405-54152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug high-profile shielded Part No. 405-54180-51

Zero8 80polig Plug High Geschirmt Foto
80 pins, unmated stacking height: 7.15 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug high-profile shielded Part No. 405-54180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s bei 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug x-high-profile shielded Part No. 405-55112-51

Zero8 12polig Plug x High geschirmt normal Foto
12 pins, unmated stacking height: 8.65mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug x-high-profile shielded Part No. 405-55112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug x-high-profile shielded Part No. 405-55120-51

Zero8 20polig Plug x High geschirmt normal Foto
20 pins, unmated stacking height: 8.65mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug x-high-profile shielded Part No. 405-55120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu über Ni
Termination areaSn über Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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Zero8 plug x-high-profile shielded Part No. 405-55132-51

Zero8 32polig Plug x High geschirmt normal Foto
32 pins, unmated stacking height: 8.65mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug x-high-profile shielded Part No. 405-55132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu über Ni
Termination areaSn über Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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Zero8 plug x-high-profile shielded Part No. 405-55152-51

Zero8 52polig Plug x High geschirmt normal Foto
52 pins, unmated stacking height: 8.65mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug x-high-profile shielded Part No. 405-55152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu über Ni
Termination areaSn über Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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Yes, load content from Supplyframe

Zero8 plug x-high-profile shielded Part No. 405-55180-51

Zero8 80polig Plug x High geschirmt normal Foto
80 pins, unmated stacking height: 8.65mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
EMC
Zero8 plug x-high-profile shielded Part No. 405-55180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu über Ni
Termination areaSn über Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
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Socket straight shielded

Zero8 socket low-profile shielded Part No. 406-52112-51

Zero8 12polig Socket Low Geschirmt Foto
12 pins, unmated stacking height: 4.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket low-profile shielded Part No. 406-52112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 socket low-profile shielded Part No. 406-52120-51

Zero8 20polig Socket Low Geschirmt Foto
20 pins, unmated stacking height: 4.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket low-profile shielded Part No. 406-52120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 socket low-profile shielded Part No. 406-52132-51

Zero8 32polig Socket Low Geschirmt Foto
32 pins, unmated stacking height: 4.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket low-profile shielded Part No. 406-52132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 socket low-profile shielded Part No. 406-52152-51

Zero8 52polig Socket Low Geschirmt Foto
52 pins, unmated stacking height: 4.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket low-profile shielded Part No. 406-52152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 socket low-profile shielded Part No. 406-52180-51

Zero8 80polig Socket Low Geschirmt Foto
80 pins, unmated stacking height: 4.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket low-profile shielded Part No. 406-52180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 socket mid-profile shielded Part No. 406-53112-51

Zero8 12polig Socket Mid Geschirmt Foto
12 pins, unmated stacking height: 7.85 mm, 12 pins, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket mid-profile shielded Part No. 406-53112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 socket mid-profile shielded Part No. 406-53120-51

Zero8 20polig Socket Mid Geschirmt Foto
20 pins, unmated stacking height: 7.85 mm, 20 pins, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket mid-profile shielded Part No. 406-53120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 socket mid-profile shielded Part No. 406-53132-51

Zero8 32polig Socket Mid Geschirmt Foto
32 pins, unmated stacking height: 7.85 mm, 32 pins, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket mid-profile shielded Part No. 406-53132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Stock Check
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Zero8 socket mid-profile shielded Part No. 406-53152-51

Zero8 52polig Socket Mid Geschirmt Foto
52 pins, unmated stacking height: 7.85 mm, 52 pins, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket mid-profile shielded Part No. 406-53152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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Zero8 socket mid-profile shielded Part No. 406-53180-51

Zero8 80polig Socket Mid Geschirmt Foto
80 pins, unmated stacking height: 7.85 mm, 80 pins, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket mid-profile shielded Part No. 406-53180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 socket high-profile shielded Part No. 406-54112-51

Zero8 12polig Socket High Geschirmt Foto
12 pins, unmated stacking height: 10.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket high-profile shielded Part No. 406-54112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 21.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 socket high-profile shielded Part No. 406-54120-51

Zero8 20polig Socket High Geschirmt Foto
20 pins, unmated stacking height: 10.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket high-profile shielded Part No. 406-54120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 21.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Stock Check
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Zero8 socket high-profile shielded Part No. 406-54132-51

Zero8 32polig Socket High Geschirmt Foto
32 pins, unmated stacking height: 10.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket high-profile shielded Part No. 406-54132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 21.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 socket high-profile shielded Part No. 406-54152-51

Zero8 52polig Socket High Geschirmt Foto
52 pins, unmated stacking height: 10.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket high-profile shielded Part No. 406-54152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 21.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 socket high-profile shielded Part No. 406-54180-51

Zero8 80polig Socket High Geschirmt Foto
80 pins, unmated stacking height: 10.85 mm, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket high-profile shielded Part No. 406-54180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 21.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbit/s

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s bei 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Plug angled shielded
Socket angled shielded

Zero8 socket angled shielded Part No. 406-51112-51

Zero8 12polig Socket gewinkelt geschirmt Foto
12 pins, right angled, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket angled shielded Part No. 406-51112-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 socket angled shielded Part No. 406-51120-51

Zero8 20polig Socket gewinkelt geschirmt Foto
20 pins, right angled, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket angled shielded Part No. 406-51120-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 socket angled shielded Part No. 406-51132-51

Zero8 32polig Socket gewinkelt geschirmt Foto
32 pins, right angled, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket angled shielded Part No. 406-51132-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 socket angled shielded Part No. 406-51152-51

Zero8 52polig Socket gewinkelt geschirmt Foto
52 pins, right angled, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket angled shielded Part No. 406-51152-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 socket angled shielded Part No. 406-51180-51

Zero8 80polig Socket gewinkelt geschirmt Foto
80 pins, right angled, EMC shielding, SMT, 0.8 mm pitch, Performance level 1
Perpendicular
Horizontal
SMT
High Density
High Speed
Rugged
EMC
Zero8 socket angled shielded Part No. 406-51180-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Plug straight unshielded

Zero8 plug low-profile unshielded Part No. 405-52012-51

Zero8 12polig Plug Low Ungeschirmt Foto
12 pins, unmated stacking height: 1.15 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug low-profile unshielded Part No. 405-52012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug low-profile unshielded Part No. 405-52020-51

Zero8 20polig Plug Low Ungeschirmt Foto
20 pins, unmated stacking height: 1.15 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug low-profile unshielded Part No. 405-52020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug low-profile unshielded Part No. 405-52032-51

Zero8 32polig Plug Low Ungeschirmt Foto
32 pins, unmated stacking height: 1.15 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug low-profile unshielded Part No. 405-52032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 plug low-profile unshielded Part No. 405-52052-51

Zero8 52polig Plug Low Ungeschirmt Foto
52 pins, unmated stacking height: 1.15 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug low-profile unshielded Part No. 405-52052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 plug low-profile unshielded Part No. 405-52080-51

Zero8 80polig Plug Low Ungeschirmt Foto
80 pins, unmated stacking height: 1.15 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug low-profile unshielded Part No. 405-52080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 13.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug mid-profile unshielded Part No. 405-53012-51

Zero8 12polig Plug Mid Ungeschirmt Foto
12 pins, unmated stacking height: 2.65 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug mid-profile unshielded Part No. 405-53012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

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Zero8 plug mid-profile unshielded Part No. 405-53020-51

Zero8 20polig Plug Mid Ungeschirmt Foto
20 pins, unmated stacking height: 2.65 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug mid-profile unshielded Part No. 405-53020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

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Zero8 plug mid-profile unshielded Part No. 405-53032-51

Zero8 32polig Plug Mid Ungeschirmt Foto
32 pins, unmated stacking height: 2.65 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug mid-profile unshielded Part No. 405-53032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

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Zero8 plug mid-profile unshielded Part No. 405-53052-51

Zero8 52polig Plug Mid Ungeschirmt Foto
52 pins, unmated stacking height: 2.65 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug mid-profile unshielded Part No. 405-53052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug mid-profile unshielded Part No. 405-53080-51

Zero8 80polig Plug Mid Ungeschirmt Foto
80 pins, unmated stacking height: 2.65 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug mid-profile unshielded Part No. 405-53080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance7.5 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug high-profile unshielded Part No. 405-54012-51

Zero8 12polig Plug High ungeschirmt Foto
12 pins, unmated stacking height: 7.15 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug high-profile unshielded Part No. 405-54012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug high-profile unshielded Part No. 405-54020-51

Zero8 20polig Plug High ungeschirmt Foto
20 pins, unmated stacking height: 7.15 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug high-profile unshielded Part No. 405-54020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu über Ni
Termination areaSn über Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug high-profile unshielded Part No. 405-54032-51

Zero8 32polig Plug High ungeschirmt Foto
32 pins, unmated stacking height: 7.15 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug high-profile unshielded Part No. 405-54032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu über Ni
Termination areaSn über Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug high-profile unshielded Part No. 405-54052-51

Zero8 52polig Plug High ungeschirmt Foto
52 pins, unmated stacking height: 7.15 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug high-profile unshielded Part No. 405-54052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu über Ni
Termination areaSn über Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Stock Check
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You can view Supplyframe's privacy policy here.

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Zero8 plug high-profile unshielded Part No. 405-54080-51

Zero8 80polig Plug High ungeschirmt Foto
80 pins, unmated stacking height: 7.15 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 plug high-profile unshielded Part No. 405-54080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance12.0 mm to 19.5 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu über Ni
Termination areaSn über Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Stock Check
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Zero8 plug x-high-profile unshielded Part No. 405-55012-51

Zero8 12polig Plug x High ungeschirmt normal Foto
12 pins, unmated stacking height: 8.65mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
Zero8 plug x-high-profile unshielded Part No. 405-55012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug x-high-profile unshielded Part No. 405-55020-51

Zero8 20polig Plug x High ungeschirmt normal Foto
20 pins, unmated stacking height: 8.65mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
Zero8 plug x-high-profile unshielded Part No. 405-55020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu über Ni
Termination areaSn über Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug x-high-profile unshielded Part No. 405-55032-51

Zero8 32polig Plug x High ungeschirmt normal Foto
32 pins, unmated stacking height: 8.65mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
Zero8 plug x-high-profile unshielded Part No. 405-55032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu über Ni
Termination areaSn über Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug x-high-profile unshielded Part No. 405-55052-51

Zero8 52polig Plug x High ungeschirmt normal Foto
52 pins, unmated stacking height: 8.65mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
Zero8 plug x-high-profile unshielded Part No. 405-55052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu über Ni
Termination areaSn über Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Zero8 plug x-high-profile unshielded Part No. 405-55080-51

Zero8 80polig Plug x High ungeschirmt normal Foto
80 pins, unmated stacking height: 8.65mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
Perpendicular
SMT
High Density
High Speed
Rugged
Zero8 plug x-high-profile unshielded Part No. 405-55080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance13.5 mm to 21.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu über Ni
Termination areaSn über Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
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Socket straight unshielded

Zero8 socket low-profile unshielded Part No. 406-52012-51

Zero8 12polig Socket Low Ungeschirmt Foto
12 pins, unmated stacking height: 4.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket low-profile unshielded Part No. 406-52012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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Zero8 socket low-profile unshielded Part No. 406-52020-51

Zero8 20polig Socket Low Ungeschirmt Foto
20 pins, unmated stacking height: 4.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket low-profile unshielded Part No. 406-52020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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Zero8 socket low-profile unshielded Part No. 406-52032-51

Zero8 32polig Socket Low Ungeschirmt Foto
32 pins, unmated stacking height: 4.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket low-profile unshielded Part No. 406-52032-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts32
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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Yes, load content from Supplyframe

Zero8 socket low-profile unshielded Part No. 406-52052-51

Zero8 52polig Socket Low Ungeschirmt Foto
52 pins, unmated stacking height: 4.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket low-profile unshielded Part No. 406-52052-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts52
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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Zero8 socket low-profile unshielded Part No. 406-52080-51

Zero8 80polig Socket Low Ungeschirmt Foto
80 pins, unmated stacking height: 4.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket low-profile unshielded Part No. 406-52080-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts80
Termination TechnologySMT
Board-to-Board Distance6.0 mm to 15.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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Zero8 socket mid-profile unshielded Part No. 406-53012-51

Zero8 12polig Socket Mid Ungeschirmt Foto
12 pins, unmated stacking height: 7.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket mid-profile unshielded Part No. 406-53012-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts12
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 socket mid-profile unshielded Part No. 406-53020-51

Zero8 20polig Socket Mid Ungeschirmt Foto
20 pins, unmated stacking height: 7.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT
High Density
High Speed
Rugged
Zero8 socket mid-profile unshielded Part No. 406-53020-51 - Technical data

Basics

Performance Level
IEC 60512-9-1:2010
1
No. of Contacts20
Termination TechnologySMT
Board-to-Board Distance9.00 mm to 18.0 mm
Operating Temperature Range-55°C to + 125°C

Material

Insulator MaterialLCP, UL 94 V-0
CTI value
IEC 60112
150
Contact MaterialCopper alloy
PlatingAu over Ni
Termination areaSn over Ni

Mechanical

Pitch0.8 mm
Mating Force per Pin≤ 0.5 N
Separating Force per Pin≤ 0.4 N
Durability
IEC 60512-9-1
500  mating cycles
Coplanarity≤ 0.1 mm
Vibration, sinusoidal
IEC 60512-6-4
10 - 2000 Hz, 20g
Contact mating problems if vibrations occur, sinusoidal
IEC 60512-2-5
≤ 1 µs
Shock, semi-sinusoidal
IEC 60512-6-3
50g, 11 ms
Contact mating problems if shock occur, semi-sinusoidal
IEC 60512-2-5
≤ 1 µs

Electrical

Operational Current
IEC 60512-5-2
1.7 A per pin at 20°C (80 of 80 pins supplied with current)
5.5 A per pin at 20°C (2 of 80 pins supplied with current)
5.1 A per pin at 20°C (4 of 80 pins supplied with current)
16 A at 20°C (shield supplied with current)
Contact Resistance
IEC 60512-2-1
≤ 20 mΩ
Clearance and Creepage0.25 mm
Insulation Resistance
IEC 60512-3-1
> 5 GΩ
Test Voltage
IEC 60512-4-1
500 VAC
Data Transfer Rate16 Gbps

Processing

Soldering Temperature
JEDEC J-STD-020E
20 - 40 s at 260°C
MSL
JEDEC J-STD-020E
1
AssemblyPick and Place

Approval / Compliance

UL fileE130314
EnvironmentRoHS konform
Stock Check
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You can view Supplyframe's privacy policy here.

Yes, load content from Supplyframe

Zero8 socket mid-profile unshielded Part No. 406-53032-51

Zero8 32polig Socket Mid Ungeschirmt Foto
32 pins, unmated stacking height: 7.85 mm, SMT, 0.8 mm pitch, Performance level 1
Parallel
SMT