backDescriptionTechnical SpecificationsDerating DiagramHole SpecificationsModificationsPackagingDownloadsStock Check
flexilink jumper, 8 contacts Part No. 991-500800-11
Illustration similar
Horizontal
Press-fit
Power
- 8 contacts
- operational current 11 A
- small footprint design
- easy processing without soldering
- variable 2 or 4 mm pitch
Technical Specifications
Basics
| No. of Contacts | 8 |
|---|---|
| Termination Technology | Press-fit |
| Board-to-Board Distance | 1 mm |
| Operating Temperature Range | -40°C to +125°C |
Material
| Insulator Material | PBT glass filled |
|---|---|
| Contact Material | Copper alloy |
| Plating | Sn |
Mechanical
| Pitch | 2 mm |
|---|
Electrical
| Operational Current | 11 A at +20°C per pin (5 contact bridges) |
|---|---|
| Contact Resistance | ≤ 5mΩ |
| Clearance and Creepage | 1.4 mm |
| Insulation Resistance | ≥ 10 GΩ |
| Test Voltage | 1500 VDC |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS compliant |
Derating Diagram
Hole Specifications
| Material | imm. Sn printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.0 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | imm. Sn plating, max. 1.5 µm |
| F Annular Ring | min. 0.1 mm |
| Material | Ni, Au printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.0 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
| F Annular Ring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Modifications
Available on request
- other pin configurations
Packaging
Bulk
250 pcs / Box