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- Technical Specifications
- Hole Specifications
- Modifications
- Packaging
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flexilink jumper, 2-contact Part No. 991-500200-11
Illustration similar
Horizontal
Press-fit
Power
- 2 contacts
- 11 A current-carrying capacity
- compact design
- Easy installation without soldering
- Can be configured in 2-mm or 4-mm increments
Technical Specifications
Basics
| No. of Contacts | 2 |
|---|---|
| Termination Technology | Press-fit technology |
| Board-to-Board Distance | 1 mm |
| Operating Temperature Range | -40°F to +125°F |
Material
| Insulator Material | Glass-fiber-reinforced PBT |
|---|---|
| Contact Material | copper alloy |
| Plating | Sn |
Mechanical
| Pitch | 2 mm |
|---|
Electrical
| Operational Current | 11 A at +20°C per pin (5 contact bridges) |
|---|---|
| Contact Resistance | ≤ 5 mΩ |
| Clearance and Creepage | 1.4 mm |
| Insulation Resistance | ≥ 10 GΩ |
| Test Voltage | 1500 VDC |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS compliant |
Hole Specifications
| Material | chem. Sn Leiterplatten |
|---|---|
| Nennloch | Ø 1.0 mm |
| A Leiterplattendicke | min. 1.0 mm |
| B Endloch | Ø 1.0 +0.09 / -0.06 mm |
| C Grundbohrung | 1.15 ±0.025 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | chem. Sn Schicht, max. 1.5 µm |
| F Restring | min. 0.1 mm |
| Material | Ni, Au Leiterplatten |
|---|---|
| Nennloch | Ø 1.0 mm |
| A Leiterplattendicke | min. 1.0 mm |
| B Endloch | Ø 1.0 +0.09 / -0.06 mm |
| C Grundbohrung | 1.15 ±0.025 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | Ni, Au Schicht, 0.05 - 0.2 µm Au über 2.5 - 5 µm Ni |
| F Restring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Modifications
Available on request
- other configuration options
Packaging
bulk goods
500 pieces per box