VarPol Angled pin header 1-row Part No. 981-nn011-b1
Illustration similar
Perpendicular
Press-fit
- length mating side (Y) = 5.6 mm
- Press-fit
- termination length 3.4 mm
- 2 - 36 contacts
- 1-row
- b in part number defines Performance Level of mating side
Technical Specifications
Basics
| No. of Contacts | 2 - 36 |
|---|---|
| Termination Technology | Press-fit |
| Termination Length | 3.4 mm |
| Operating Temperature Range | -55°C to +125°C |
Material
| Insulator Material | PBT glass filled, UL 94 V-0 |
|---|---|
| Contact Material | Copper alloy |
Mechanical
| Pitch | 2.54 mm |
|---|---|
| Mating Force per Pin | max. 0.9 N |
| Separating Force per Pin | min 0.6 N |
Electrical
| Operational Current | max. 1.9 A |
|---|---|
| Operational Voltage | 150 V |
| Contact Resistance | < 20 mΩ |
| Clearance and Creepage | 1.2 mm |
| Insulation Resistance | >106 MΩ |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS compliant |
Hole Specifications
| Material | imm. Sn printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | imm. Sn plating, max. 1.5 µm |
| F Annular Ring | min. 0.1 mm |
| Material | Ni, Au printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
| F Annular Ring | min. 0.1 mm |
| Material | pure Cu printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | OSP*, z.B. GLICOAT-SMD (F2) with 0.12 - 0.15 µm |
| F Annular Ring | min. 0.1 mm |
| Material | HAL Sn printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | HAL Sn, 5 - 15 µm |
| F Annular Ring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
