VarPol Straight pin header 2-row Part No. 972-nn018-b1
Illustration similar
Parallel
Press-fit
- length mating face (Y) = 17.5 mm
- Press-fit
- termination length 3.4 mm
- 2 - 108 contacts (nn in part number = pins / row)
- 2-row
- b in part number defines Performance Level of mating side
Technical Specifications
Basics
No. of Contacts | 2 - 108 |
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Termination Technology | Press-fit |
Termination Length | 3.4 mm |
Board-to-Board Distance | 23.95 mm - 27.95 mm |
Operating Temperature Range | -55°C to +125°C |
Material
Insulator Material | PBT glass filled, UL 94 V-0 |
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Contact Material | Copper alloy |
Mechanical
Pitch | 2.54 mm |
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Mating Force per Pin | max. 0.9 N |
Separating Force per Pin | min 0.6 N |
Electrical
Operational Current | max. 1.9 A |
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Operational Voltage | 150 V |
Contact Resistance | < 20 mΩ |
Clearance and Creepage | 1.2 mm |
Insulation Resistance | >106 MΩ |
Approval / Compliance
UL file | E130314 |
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Environment | RoHS compliant |
Hole Specifications
Material | imm. Sn printed circuit boards |
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Nominal Hole | Ø 1.0 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
C Drill Hole | 1.15 ±0.025 mm |
D Cu Plating | min. 25 µm |
E Surface | imm. Sn plating, max. 1.5 µm |
F Annular Ring | min. 0.1 mm |
Material | Ni, Au printed circuit boards |
---|---|
Nominal Hole | Ø 1.0 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
C Drill Hole | 1.15 ±0.025 mm |
D Cu Plating | min. 25 µm |
E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
F Annular Ring | min. 0.1 mm |
Material | pure Cu printed circuit boards |
---|---|
Nominal Hole | Ø 1.0 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
C Drill Hole | 1.15 ±0.025 mm |
D Cu Plating | min. 25 µm |
E Surface | OSP, z.B. GLICOAT-SMD (F2) with 0.12 - 0.15 µm |
F Annular Ring | min. 0.1 mm |
Material | HAL Sn printed circuit boards |
---|---|
Nominal Hole | Ø 1.0 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
C Drill Hole | 1.15 ±0.025 mm |
D Cu Plating | min. 25 µm |
E Surface | HAL Sn, 5 - 15 µm |
F Annular Ring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5