- back
- Description
- Technical Specifications
- Hole Specifications
- Matching Products
- Accessories
- Processing
- Packaging
- Downloads
- Stock Check
Power Terminals, 5.08 x 10.16 mm pitch Part No. 911-32044
Illustration similar
Press-fit
Power
Rugged
- M4 thread
- Connection length: 5 mm
Technical Specifications
Basics
| Termination Technology | Press-fit technology |
|---|---|
| Termination Length | 5 mm |
| Operating Temperature Range | -55°C to +125°C |
Material
| Contact Material | copper alloy |
|---|---|
| Plating | Sn |
Mechanical
| Pitch | 5.08 x 10.16 mm |
|---|
Electrical
| Operational Current | 20° 45', 70° 30', 100° 25' |
|---|
Processing
| Thread | M4 |
|---|---|
| Max. Fastening Torque | 1.3 Nm |
Approval / Compliance
| Environment | RoHS compliant |
|---|
Hole Specifications
| Material | chem. Sn Leiterplatten |
|---|---|
| Nennloch | Ø 1.45 mm |
| A Leiterplattendicke | min. 2.9 mm |
| B Endloch | Ø 1.45 +0.09 / -0.06 mm |
| C Grundbohrung | 1.60 ±0.025 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | chem. Sn Schicht, max. 1.5 µm |
| F Restring | min. 0.1 mm |
| Material | Ni, Au Leiterplatten |
|---|---|
| Nennloch | Ø 1.45 mm |
| A Leiterplattendicke | min. 2.9 mm |
| B Endloch | Ø 1.45 +0.09 / -0.06 mm |
| C Grundbohrung | 1.60 ±0.025 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | Ni, Au Schicht, 0.05 - 0.2 µm Au über 2.5 - 5 µm Ni |
| F Restring | min. 0.1 mm |
| Material | HAL Sn Leiterplatten |
|---|---|
| Nennloch | Ø 1.45 mm |
| A Leiterplattendicke | min. 2.9 mm |
| B Endloch | Ø 1.45 +0.09 / -0.06 mm |
| C Grundbohrung | 1.60 ±0.025 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | HAL Sn, 5 - 15 µm |
| F Restring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Matching Products
Accessories
Processing
Packaging
bulk goods