backDescriptionTechnical SpecificationsDerating DiagramHole SpecificationsMatching ProductsModificationsProcessingPackagingDownloadsStock Check
ATCA Power Part No. 512-50501-163
Illustration similar
Perpendicular
Press-fit
Power
Rugged
- contacts: 26 signal, 8 power
- Press-fit
- according to PICMG specifications
Technical Specifications
Basics
| Specification | PICMG® 3.0 R2.0 |
|---|---|
| No. of Contacts | 34 (8 Power, 26 Signal) |
| Termination Technology | Press-fit |
| Termination Length | 4.45 mm |
| Operating Temperature Range | -55°C to +125°C |
Material
| Insulator Material | PBT glass filled, UL 94 V-0 |
|---|---|
| Contact Material | Copper alloy |
| Plating | Au over Ni |
Mechanical
| Mating Force | max. 67 N |
|---|---|
| Separating Force | max. 67 N |
| Durability | 250 mating cycles |
Electrical
| Operational Current | Power contacts: max. 16 A, Signal contacts: max. 1 A |
|---|---|
| Insulation Resistance | ≥ 1010 Ω |
| Test Voltage | Contact 1 - 16: 1000 V r.m.s; contact 17 - 34: 2000 V r.m.s. |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS compliant |
Derating Diagram
Hole Specifications
| Material | imm. Sn printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 2.9 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | imm. Sn plating, max. 1.5 µm |
| F Annular Ring | min. 0.1 mm |
| Material | Ni, Au printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 2.9 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
| F Annular Ring | min. 0.1 mm |
| Material | imm. Sn printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.6 mm |
| A PCB Thickness | min 2.9 mm |
| B Plated Hole | Ø 1.6 +0.09 / -0.06 mm |
| C Drill Hole | 1.75 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | imm. Sn plating, max. 1.5 µm |
| F Annular Ring | min. 0.1 mm |
| Material | Ni, Au printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.6 mm |
| A PCB Thickness | min 2.9 mm |
| B Plated Hole | Ø 1.6 +0.09 / -0.06 mm |
| C Drill Hole | 1.75 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
| F Annular Ring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Matching Products
Modifications
Available on request
- different number of contacts
Processing
Packaging
Tray
32 pcs / Tray
5 Tray / Box