You reserved the following product for your request:

Velox High-Speed Backplane

Modular Backplane Connector System
Velox® is a modular connector system for high-speed backplane applications. It was specifically designed for markets with high performance requirements.The Velox® product series meets the demanding requirements of VITA46 systems. Four different types are available, and customized assembly is possible. This gives developers more flexibility when designing circuit board layouts. In addition, a 1.27-µm gold surface ensures the durability of the system.

10 Gbps
robust design
tested in accordance with VITA46
long service life
‘Heavy gold’ coating
internal contacts
modular connector system
customized contact assembly

More information on Velox

Velox 16-left Part No. 308-52100-42

FREE samples

Description Technical Specifications Dimensions Hole Specifications

Illustration similar

Velox Center assembly design 308-52100-4x

plating Press-fit Zone: Sn (RoHS compliant)
fully loaded (144 contacts)
termination technology: Press-fit
pitch 1.8 mm
data transfer rate 10 Gbit/s

Further Information

Product Data Sheet

Delivery time

go to stock check

Basics

Specification	VITA 46
No. of Contacts	144
Termination Technology	Press-fit
Termination Length	1.62 mm
Operating Temperature Range	-55°C to +105°C

Material

Insulator Material	LCP, UL 94 V-0
CTI value IEC 60112	175
Contact Material	Phosphor Bronze
Plating	1.27 µm Au over Ni on contact area, Sn on Press-fit zone

Mechanical

Pitch	1.8 mm
Mating Force per Pin	max. 0.75 N
Separating Force per Pin	min. 0.15 N
Durability	200 mating cycles

Electrical

Operational Current	1.0 A (<30°C)
Operational Voltage	50 VAC Peak or DC
Contact Resistance	max. 80 mΩ
Clearance and Creepage	≥ 0.7 mm
Insulation Resistance	min. 1000 MΩ
Test Voltage	500 V (AC/DC)
Data Transfer Rate	10 Gbit/s

Approval / Compliance

UL file	E130314
Environment	RoHS compliant

Velox 16-left dimensions Velox FL 16 left Lochbild

For details please download the drawings or contact ept directly.

Material	imm. Sn printed circuit boards
Nominal Hole	Ø 0.56 mm
A PCB Thickness	min 1.44 mm
B Plated Hole	Ø 0.56 ±0.05 mm
C Drill Hole	0.65 ±0.02 mm
D Cu Plating	min. 25 µm
E Surface	imm. Sn plating, max. 1.5 µm
F Annular Ring	min. 0.1 mm

Material	Ni, Au printed circuit boards
Nominal Hole	Ø 0.56 mm
A PCB Thickness	min 1.44 mm
B Plated Hole	Ø 0.56 ±0.05 mm
C Drill Hole	0.65 ±0.02 mm
D Cu Plating	min. 25 µm
E Surface	Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni
F Annular Ring	min. 0.1 mm