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DIN 41612 VME 64x female Part No. 306-66069-14
Illustration similar
Perpendicular
Press-fit
Rugged
- Termination length 17 mm
- with plug-in zone in performance level 1
- 160 contacts
- Press-fit
- performance level 1
- without flange
Technical Specifications
Basics
Specification | IEC 61076-4-113 |
---|---|
Performance Level | 1 |
No. of Contacts | 160 |
Termination Technology | Press-fit |
Termination Length | 17 mm |
Operating Temperature Range | -55°C to +125°C |
Material
Insulator Material | PBT glass filled UL 94 V-0 |
---|---|
CTI value IEC 60112 | 200 |
Contact Material | Copper alloy |
Mechanical
Pitch | 2.54 mm |
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Mating Force | 160 N |
Separating Force per Pin | > 0.15 N |
Durability | 500 mating cycles |
Electrical
Operational Current | 1.5 A |
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Contact Resistance | <20 mΩ |
Clearance and Creepage | abc ≥ 1.2 mm, zd ≥ 1.0 mm |
Insulation Resistance | 104 MΩ |
Test Voltage | 1000 V |
Approval / Compliance
UL file | E130314 |
---|---|
Environment | RoHS compliant |
Hole Specifications
Material | imm. Sn printed circuit boards |
---|---|
Nominal Hole | Ø 1.0 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
C Drill Hole | 1.15 ±0.025 mm |
D Cu Plating | min. 25 µm |
E Surface | imm. Sn plating, max. 1.5 µm |
F Annular Ring | min. 0.1 mm |
Material | Ni, Au printed circuit boards |
---|---|
Nominal Hole | Ø 1.0 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
C Drill Hole | 1.15 ±0.025 mm |
D Cu Plating | min. 25 µm |
E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
F Annular Ring | min. 0.1 mm |
Material | pure Cu printed circuit boards |
---|---|
Nominal Hole | Ø 1.0 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
C Drill Hole | 1.15 ±0.025 mm |
D Cu Plating | min. 25 µm |
E Surface | OSP, z.B. GLICOAT-SMD (F2) with 0.12 - 0.15 µm |
F Annular Ring | min. 0.1 mm |
Material | HAL Sn printed circuit boards |
---|---|
Nominal Hole | Ø 1.0 mm |
A PCB Thickness | min 1.44 mm |
B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
C Drill Hole | 1.15 ±0.025 mm |
D Cu Plating | min. 25 µm |
E Surface | HAL Sn, 5 - 15 µm |
F Annular Ring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5