hm2.0 lower shield plate, Type F Part No. 246-31600-1
Illustration similar
Perpendicular
Press-fit
- 11 contacts
- Connector length: 3.4 mm
- for PCB thickness of at least 1.44 mm
- Tested in accordance with IEC 61076-4-101
Technical Specifications
Basics
| Specification | IEC 61076-4-101 |
|---|---|
| Performance Level | 2 |
| No. of Contacts | 11 |
| Termination Technology | Press-fit technology |
| Termination Length | 3.4 mm |
| Operating Temperature Range | -55°C to +125°C |
Material
| Contact Material | Bronze |
|---|
Mechanical
| Pitch | 2.0 mm |
|---|---|
| Mating Force per Pin | Shielding: max. 1 N |
| Separating Force per Pin | Shielding: min. 0.15 N |
| Durability | > 250 insertion cycles |
Electrical
| Operational Current | 1.5 A at +20°C, 1.0 A at +70°C |
|---|---|
| Contact Resistance | max. 20 mΩ |
| Insulation Resistance | at least 104 MΩ |
| Test Voltage | 750 V r.m.s. |
| Data Transfer Rate | 3.125 Gbit/s |
Approval / Compliance
| Environment | RoHS compliant |
|---|
Hole Specifications
| Material | chem. Sn Schicht |
|---|---|
| Nennloch | Ø 0.6 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 0.60 ±0.05 mm |
| C Grundbohrung | 0.70 ±0.02 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | max. 1.5 µm; chem. Sn Leiterplatten |
| F Restring | min. 0.1 mm |
| Material | Ni, Au Leiterplatten |
|---|---|
| Nennloch | Ø 0.6 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 0.60 ±0.05 mm |
| C Grundbohrung | 0.70 ±0.02 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | Ni, Au Schicht, 0.05 - 0.2 µm Au über 2.5 - 5 µm Ni |
| F Restring | min. 0.1 mm |
| Material | rein Cu Leiterplatten |
|---|---|
| Nennloch | Ø 0.6 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 0.60 ±0.05 mm |
| C Grundbohrung | 0.70 ±0.02 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | OSP*,z.B. GLICOAT-SMD (F2) mit 0.12 - 0.15 µm |
| F Restring | min. 0.1 mm |
| Material | HAL Sn Leiterplatten |
|---|---|
| Nennloch | Ø 0.6 mm |
| A Leiterplattendicke | min. 1.44 mm |
| B Endloch | Ø 0.60 ±0.05 mm |
| C Grundbohrung | 0.70 ±0.02 mm |
| D Cu Schicht | min. 25 µm |
| E Oberfläche | HAL Sn, 5 - 15 µm |
| F Restring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Processing
pliers
Einpresswerkzeug für hm2.0 unteres Schirmblech 8reihig
Artikelnummer 884-740-W3
Packaging
Tray
24 pieces per tray
25 trays per box