- back
- Description
- Technical Specifications
- Hole Specifications
- Modifications
- Processing
- Packaging
- Downloads
- Stock Check
DIN 41612 Male straight, type R/3 Part No. 115-78015
Illustration similar
Parallel
Perpendicular
Press-fit
Rugged
- Termination length 13 mm
- with plug-in zone in performance level 2
- 30 contacts
- Press-fit
- performance level 2
Technical Specifications
Basics
| Specification | IEC 60603-2 (DIN 41612) |
|---|---|
| Performance Level | 2 |
| No. of Contacts | 30 |
| Termination Technology | Press-fit |
| Termination Length | 13 mm |
| Board-to-Board Distance | 16.85 mm |
| Operating Temperature Range | -55°C to +125°C |
Material
| Insulator Material | PBT glass filled UL 94 V-0 |
|---|---|
| CTI value IEC 60112 | 200 |
| Contact Material | Copper alloy |
Mechanical
| Pitch | 2.54 mm |
|---|---|
| Mating Force | < 28 N |
| Separating Force per Pin | > 0.15 N |
| Durability | 400 mating cycles |
Electrical
| Operational Current | 2.6 A |
|---|---|
| Contact Resistance | <20 mΩ |
| Clearance and Creepage | ≥ 1.2 mm |
| Insulation Resistance | >106 MΩ |
| Test Voltage | 1000 V |
Approval / Compliance
| UL file | E130314 |
|---|---|
| Environment | RoHS compliant |
Hole Specifications
| Material | imm. Sn printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | imm. Sn plating, max. 1.5 µm |
| F Annular Ring | min. 0.1 mm |
| Material | Ni, Au printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | Ni, Au plating, 0.05 - 0.2 µm Au over 2.5 - 5 µm Ni |
| F Annular Ring | min. 0.1 mm |
| Material | pure Cu printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | OSP, z.B. GLICOAT-SMD (F2) with 0.12 - 0.15 µm |
| F Annular Ring | min. 0.1 mm |
| Material | HAL Sn printed circuit boards |
|---|---|
| Nominal Hole | Ø 1.0 mm |
| A PCB Thickness | min 1.44 mm |
| B Plated Hole | Ø 1.0 +0.09 / -0.06 mm |
| C Drill Hole | 1.15 ±0.025 mm |
| D Cu Plating | min. 25 µm |
| E Surface | HAL Sn, 5 - 15 µm |
| F Annular Ring | min. 0.1 mm |
Plated through-hole according to IEC 60352-5
Modifications
Available on request
- Pre-mating and late-mating contacts
- Without flange
- Special contact length
- Performance levels I + III or customer-specific
- Contact arrangement
Processing
Packaging
Box
100 pcs / Box
7 Box / Box